AGLE600V2-FG256
| Part Description |
IGLOOe Field Programmable Gate Array (FPGA) IC 165 110592 13824 256-LBGA |
|---|---|
| Quantity | 546 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 52 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 165 | Voltage | 1.14 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 13824 | Number of Logic Elements/Cells | 13824 | ||
| Number of Gates | 600000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 110592 |
Overview of AGLE600V2-FG256 – IGLOOe Field Programmable Gate Array (FPGA) IC, 13,824 logic elements, 165 I/Os, 256-LBGA
The AGLE600V2-FG256 is an IGLOOe Field Programmable Gate Array (FPGA) designed for commercial embedded applications. It provides a balance of programmable logic, embedded memory, and I/O density in a compact 256-LBGA package.
With 13,824 logic elements, approximately 0.11 Mbits of on-chip RAM, and 165 general-purpose I/Os, this device targets designs that need moderate logic capacity, local memory, and a high I/O count while operating within standard commercial temperature and voltage ranges.
Key Features
- Logic Capacity 13,824 logic elements and 600,000 gates provide the programmable fabric for implementing custom logic functions and control paths.
- Embedded Memory Approximately 0.11 Mbits of on-chip RAM for local buffering, state storage, and small data structures.
- I/O Density 165 available I/Os to support multiple interfaces, peripheral connections, and system-level integration.
- Power Supports a core supply range of 1.14 V to 1.575 V to match system power domains.
- Package & Mounting 256-LBGA package (supplier device package: 256-FPBGA, 17 × 17) with surface-mount mounting for compact board-level integration.
- Operating Range & Grade Commercial-grade device rated for 0 °C to 70 °C operation.
- Environmental Compliance RoHS compliant for regulatory alignment in commercial electronics.
Unique Advantages
- High programmable density: 13,824 logic elements enable implementation of substantial custom logic without external ASICs.
- On-chip memory for local data handling: Approximately 0.11 Mbits of embedded RAM reduces dependence on external memory for small buffers and control data.
- Generous I/O count: 165 I/Os simplify integration with peripherals and system interfaces, reducing the need for external I/O expanders.
- Compact board footprint: 256-LBGA (17×17) packaging and surface-mount mounting support dense board designs.
- Low-voltage core operation: Support for 1.14 V to 1.575 V supplies aligns with modern low-voltage power architectures.
- Commercial temperature suitability: Rated for 0 °C to 70 °C operation for standard commercial applications.
Why Choose AGLE600V2-FG256?
The AGLE600V2-FG256 delivers a practical combination of programmable logic, on-chip memory, and I/O capacity in a compact, RoHS-compliant 256-LBGA package. Its specification set matches the needs of commercial embedded system designs that require moderate logic resources, local RAM, and ample I/O in a small board footprint.
This device is suited for customers seeking a commercially graded FPGA solution that balances integration and flexibility while operating within standard voltage and temperature ranges.
Request a quote or submit an inquiry to receive pricing, availability, and ordering information for AGLE600V2-FG256.

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