AGLE600V2-FG256

IC FPGA 165 I/O 256FBGA
Part Description

IGLOOe Field Programmable Gate Array (FPGA) IC 165 110592 13824 256-LBGA

Quantity 546 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 70°C
Package / Case256-LBGANumber of I/O165Voltage1.14 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs13824Number of Logic Elements/Cells13824
Number of Gates600000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits110592

Overview of AGLE600V2-FG256 – IGLOOe Field Programmable Gate Array (FPGA) IC, 13,824 logic elements, 165 I/Os, 256-LBGA

The AGLE600V2-FG256 is an IGLOOe Field Programmable Gate Array (FPGA) designed for commercial embedded applications. It provides a balance of programmable logic, embedded memory, and I/O density in a compact 256-LBGA package.

With 13,824 logic elements, approximately 0.11 Mbits of on-chip RAM, and 165 general-purpose I/Os, this device targets designs that need moderate logic capacity, local memory, and a high I/O count while operating within standard commercial temperature and voltage ranges.

Key Features

  • Logic Capacity 13,824 logic elements and 600,000 gates provide the programmable fabric for implementing custom logic functions and control paths.
  • Embedded Memory Approximately 0.11 Mbits of on-chip RAM for local buffering, state storage, and small data structures.
  • I/O Density 165 available I/Os to support multiple interfaces, peripheral connections, and system-level integration.
  • Power Supports a core supply range of 1.14 V to 1.575 V to match system power domains.
  • Package & Mounting 256-LBGA package (supplier device package: 256-FPBGA, 17 × 17) with surface-mount mounting for compact board-level integration.
  • Operating Range & Grade Commercial-grade device rated for 0 °C to 70 °C operation.
  • Environmental Compliance RoHS compliant for regulatory alignment in commercial electronics.

Unique Advantages

  • High programmable density: 13,824 logic elements enable implementation of substantial custom logic without external ASICs.
  • On-chip memory for local data handling: Approximately 0.11 Mbits of embedded RAM reduces dependence on external memory for small buffers and control data.
  • Generous I/O count: 165 I/Os simplify integration with peripherals and system interfaces, reducing the need for external I/O expanders.
  • Compact board footprint: 256-LBGA (17×17) packaging and surface-mount mounting support dense board designs.
  • Low-voltage core operation: Support for 1.14 V to 1.575 V supplies aligns with modern low-voltage power architectures.
  • Commercial temperature suitability: Rated for 0 °C to 70 °C operation for standard commercial applications.

Why Choose AGLE600V2-FG256?

The AGLE600V2-FG256 delivers a practical combination of programmable logic, on-chip memory, and I/O capacity in a compact, RoHS-compliant 256-LBGA package. Its specification set matches the needs of commercial embedded system designs that require moderate logic resources, local RAM, and ample I/O in a small board footprint.

This device is suited for customers seeking a commercially graded FPGA solution that balances integration and flexibility while operating within standard voltage and temperature ranges.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for AGLE600V2-FG256.

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