AGLE600V5-FG256I

IC FPGA 165 I/O 256FBGA
Part Description

IGLOOe Field Programmable Gate Array (FPGA) IC 165 110592 13824 256-LBGA

Quantity 1,090 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case256-LBGANumber of I/O165Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs13824Number of Logic Elements/Cells13824
Number of Gates600000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits110592

Overview of AGLE600V5-FG256I – IGLOOe FPGA, 256-LBGA

The AGLE600V5-FG256I is an IGLOOe Field Programmable Gate Array (FPGA) IC from Microchip Technology provided in a 256-LBGA package. It delivers 13,824 logic elements, approximately 0.11 Mbits of embedded memory (110,592 total RAM bits) and a gate capacity of 600,000 gates, with 165 available I/O pins for system interfacing.

Designed as an industrial-grade, surface-mount device, the part operates over a supply range of 1.425 V to 1.575 V and an ambient temperature range of -40°C to 85°C, offering a compact, manufacturable solution for designs requiring programmable logic in a 256-FPBGA (17×17) footprint.

Key Features

  • Core Logic — 13,824 logic elements provide the programmable fabric required for custom digital functions and glue logic.
  • Gate Density — 600,000 gates available to implement medium-complexity designs and IP blocks.
  • Embedded Memory — Approximately 0.11 Mbits of on-chip RAM (110,592 bits) for data buffering, state storage and small memory structures.
  • I/O Resources — 165 user I/Os to support a variety of external interfaces and peripheral connections.
  • Power Supply — Nominal operating supply range of 1.425 V to 1.575 V for core power planning and regulator selection.
  • Package & Mounting — 256-LBGA package (supplier device package: 256-FPBGA, 17×17) in a surface-mount form factor for board-level assembly.
  • Temperature & Grade — Industrial-grade device with an operating temperature range of -40°C to 85°C suitable for industrial environments.
  • Compliance — RoHS compliant, supporting regulatory requirements for lead-free assemblies.

Unique Advantages

  • Balanced logic and memory capacity: The combination of 13,824 logic elements and ~0.11 Mbits of embedded RAM supports mid-range programmable functions without external memory in some use cases.
  • Compact system footprint: The 256-LBGA (256-FPBGA 17×17) package enables high-density board layouts while maintaining substantial I/O and logic resources.
  • Industrial temperature rating: Operation from -40°C to 85°C allows deployment in temperature-challenging environments consistent with industrial-grade requirements.
  • Well-defined power envelope: A narrow core supply range (1.425 V–1.575 V) simplifies power-supply design and validation for production systems.
  • Regulatory alignment: RoHS compliance supports integration into lead-free manufacturing flows and compliant product lines.

Why Choose AGLE600V5-FG256I?

The AGLE600V5-FG256I positions itself as a compact, industrial-grade FPGA option that combines a meaningful complement of logic elements, embedded RAM, and I/O in a 256-LBGA package. Its defined supply range and operating temperature make it suitable for engineered systems where manufacturability and environmental tolerance are important considerations.

This part is appropriate for designers and procurement teams seeking a programmable logic device from Microchip Technology that balances logic density, on-chip memory and I/O count while meeting RoHS requirements and industrial temperature specifications.

Request a quote or submit an inquiry to receive pricing and availability information for the AGLE600V5-FG256I.

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