AGLN010V2-QNG48

IC FPGA 34 I/O 48QFN
Part Description

IGLOO nano Field Programmable Gate Array (FPGA) IC 34 260 48-VFQFN Exposed Pad

Quantity 172 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package48-QFN (6x6)GradeCommercialOperating Temperature-20°C – 85°C
Package / Case48-VFQFN Exposed PadNumber of I/O34Voltage1.14 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs260Number of Logic Elements/Cells260
Number of Gates10000ECCN3A991DHTS Code8542.39.0001
QualificationN/A

Overview of AGLN010V2-QNG48 – IGLOO nano FPGA, 34 I/O, 260 Logic Elements, 48‑VFQFN

The AGLN010V2-QNG48 is an IGLOO nano Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides 260 logic elements (LEs) and up to 34 general-purpose I/O in a compact 48‑VFQFN exposed pad package intended for surface-mount assembly.

Engineered for compact embedded designs that require programmable logic capacity within a small footprint, this commercial-grade device operates from 1.14 V to 1.575 V and across an operating temperature range of −20 °C to 85 °C.

Key Features

  • Core Logic  260 logic elements, suitable for moderate-density programmable logic implementations and glue-logic functions.
  • Logic Density  Approximately 10,000 equivalent gates, providing a clear indicator of integration capability for small to mid-level designs.
  • I/O  34 general-purpose I/O pins to support peripheral interfacing and signal routing in constrained layouts.
  • Memory  No on-chip RAM (total RAM bits: 0), for designs that rely on external memory or are optimized for combinational/sequential logic without embedded RAM requirements.
  • Power Supply  Operates from 1.14 V to 1.575 V, enabling low-voltage system integration where this supply range is required.
  • Package & Mounting  48‑VFQFN exposed pad (48‑QFN, 6×6 mm) in a surface-mount form factor, supporting compact board designs and thermal conduction through the exposed pad.
  • Temperature & Grade  Commercial grade with an operating temperature range of −20 °C to 85 °C.
  • Environmental Compliance  RoHS compliant for regulatory alignment in lead-free assemblies.

Typical Applications

  • Embedded Control  Used for compact control logic in embedded systems where moderate programmable logic capacity and a limited number of I/O are required.
  • I/O Consolidation  Acts as a programmable interface or glue logic component for consolidating signals between system blocks within constrained PCB space.
  • Prototyping and Evaluation  Suitable for functional prototyping of small FPGA-based designs that map to ~260 logic elements and up to 34 I/O.

Unique Advantages

  • Compact, exposed‑pad QFN package: 48‑VFQFN (6×6 mm) enables small PCB footprint and improved thermal path through the exposed pad.
  • Defined logic capacity: 260 logic elements and approximately 10,000 gates provide clear design boundaries for mid-density programmable logic tasks.
  • Low‑voltage operation: 1.14 V to 1.575 V supply range allows integration into systems that use lower core voltages.
  • Straightforward I/O provisioning: 34 I/O pins give designers a predictable interface budget for peripheral connectivity and signal routing.
  • Commercial-grade reliability: Specified for −20 °C to 85 °C operation, appropriate for general-purpose commercial applications.
  • RoHS compliant: Conforms to lead-free assembly requirements for regulatory and manufacturing consistency.

Why Choose AGLN010V2-QNG48?

The AGLN010V2-QNG48 positions itself as a compact, commercially graded IGLOO nano FPGA option for designs that need a modest amount of programmable logic and a moderate I/O count in a small QFN package. Its well-defined logic element count, gate equivalent, and supply/temperature specifications make it straightforward to assess for space-constrained embedded systems, interface consolidation, and small-scale prototyping.

This device is suited to customers and design teams looking for predictable integration parameters—package size, I/O budget, logic capacity, supply range, and operating temperature—so they can quickly determine fit within their BOM and PCB constraints.

If you need pricing or availability for AGLN010V2-QNG48, request a quote or submit a sales inquiry and our team will provide the next steps.

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