AGLN010V2-QNG48
| Part Description |
IGLOO nano Field Programmable Gate Array (FPGA) IC 34 260 48-VFQFN Exposed Pad |
|---|---|
| Quantity | 172 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 48-QFN (6x6) | Grade | Commercial | Operating Temperature | -20°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 48-VFQFN Exposed Pad | Number of I/O | 34 | Voltage | 1.14 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 260 | Number of Logic Elements/Cells | 260 | ||
| Number of Gates | 10000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of AGLN010V2-QNG48 – IGLOO nano FPGA, 34 I/O, 260 Logic Elements, 48‑VFQFN
The AGLN010V2-QNG48 is an IGLOO nano Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides 260 logic elements (LEs) and up to 34 general-purpose I/O in a compact 48‑VFQFN exposed pad package intended for surface-mount assembly.
Engineered for compact embedded designs that require programmable logic capacity within a small footprint, this commercial-grade device operates from 1.14 V to 1.575 V and across an operating temperature range of −20 °C to 85 °C.
Key Features
- Core Logic 260 logic elements, suitable for moderate-density programmable logic implementations and glue-logic functions.
- Logic Density Approximately 10,000 equivalent gates, providing a clear indicator of integration capability for small to mid-level designs.
- I/O 34 general-purpose I/O pins to support peripheral interfacing and signal routing in constrained layouts.
- Memory No on-chip RAM (total RAM bits: 0), for designs that rely on external memory or are optimized for combinational/sequential logic without embedded RAM requirements.
- Power Supply Operates from 1.14 V to 1.575 V, enabling low-voltage system integration where this supply range is required.
- Package & Mounting 48‑VFQFN exposed pad (48‑QFN, 6×6 mm) in a surface-mount form factor, supporting compact board designs and thermal conduction through the exposed pad.
- Temperature & Grade Commercial grade with an operating temperature range of −20 °C to 85 °C.
- Environmental Compliance RoHS compliant for regulatory alignment in lead-free assemblies.
Typical Applications
- Embedded Control Used for compact control logic in embedded systems where moderate programmable logic capacity and a limited number of I/O are required.
- I/O Consolidation Acts as a programmable interface or glue logic component for consolidating signals between system blocks within constrained PCB space.
- Prototyping and Evaluation Suitable for functional prototyping of small FPGA-based designs that map to ~260 logic elements and up to 34 I/O.
Unique Advantages
- Compact, exposed‑pad QFN package: 48‑VFQFN (6×6 mm) enables small PCB footprint and improved thermal path through the exposed pad.
- Defined logic capacity: 260 logic elements and approximately 10,000 gates provide clear design boundaries for mid-density programmable logic tasks.
- Low‑voltage operation: 1.14 V to 1.575 V supply range allows integration into systems that use lower core voltages.
- Straightforward I/O provisioning: 34 I/O pins give designers a predictable interface budget for peripheral connectivity and signal routing.
- Commercial-grade reliability: Specified for −20 °C to 85 °C operation, appropriate for general-purpose commercial applications.
- RoHS compliant: Conforms to lead-free assembly requirements for regulatory and manufacturing consistency.
Why Choose AGLN010V2-QNG48?
The AGLN010V2-QNG48 positions itself as a compact, commercially graded IGLOO nano FPGA option for designs that need a modest amount of programmable logic and a moderate I/O count in a small QFN package. Its well-defined logic element count, gate equivalent, and supply/temperature specifications make it straightforward to assess for space-constrained embedded systems, interface consolidation, and small-scale prototyping.
This device is suited to customers and design teams looking for predictable integration parameters—package size, I/O budget, logic capacity, supply range, and operating temperature—so they can quickly determine fit within their BOM and PCB constraints.
If you need pricing or availability for AGLN010V2-QNG48, request a quote or submit a sales inquiry and our team will provide the next steps.

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