AGLN010V2-UCG36
| Part Description |
IGLOO nano Field Programmable Gate Array (FPGA) IC 23 260 36-WFBGA, CSPBGA |
|---|---|
| Quantity | 1,069 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 36-UCSP (3x3) | Grade | Commercial | Operating Temperature | -20°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 36-WFBGA, CSPBGA | Number of I/O | 23 | Voltage | 1.14 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 260 | Number of Logic Elements/Cells | 260 | ||
| Number of Gates | 10000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of AGLN010V2-UCG36 – IGLOO nano FPGA, 23 I/O, 260 logic elements
The AGLN010V2-UCG36 is an IGLOO nano field programmable gate array (FPGA) IC designed for low-power, small-footprint embedded logic tasks. It combines flash-based reprogrammable logic with low-voltage operation and security-capable in-system programming, making it suited for compact commercial applications that require retained configuration, mixed-voltage I/O flexibility, and minimal standby power.
Key Features
- Logic Capacity — 260 logic elements (approximately 10,000 system gates) providing compact programmable logic for glue logic, protocol adaptation, and control functions.
- I/O — 23 user I/Os in the 36-WFBGA / CSPBGA package, with series-level support for mixed-voltage I/Os across multiple banks.
- Voltage Support — Core and I/O supply range specified from 1.14 V to 1.575 V for low-voltage system integration.
- Low Power Operation — Series features include Flash*Freeze low-power mode and nanoPower consumption characteristics to minimize active and standby energy usage.
- Reprogrammable Flash and Security — Flash-based FPGA fabric retains programmed design when powered off; supports in-system programming with on-chip AES decryption and FlashLock security mechanisms (series-level features).
- Performance — Series-level system performance references up to 250 MHz at 1.5 V and 160 MHz at 1.2 V for appropriate devices and operating points.
- Packaging and Mounting — Surface-mount device in 36-WFBGA / CSPBGA footprint; supplier device package 36-UCSP (3×3 mm) for minimal PCB area.
- Operating Range and Compliance — Commercial grade with operating temperature range −20 °C to +85 °C and RoHS compliance.
- On-chip Memory — This specific device reports 0 bits of on-chip SRAM; series includes small embedded FlashROM for user nonvolatile storage (series-level feature).
Typical Applications
- Battery-powered and portable devices — Low-voltage operation and Flash*Freeze support reduce standby and active power for prolonged battery life.
- Embedded control and glue logic — Compact logic capacity and 23 I/Os enable protocol adaptation, signal conditioning, and control tasks in space-constrained boards.
- Secure in-field updates — Reprogrammable flash with AES-based in-system programming supports secure firmware and FPGA configuration updates.
- Mixed-voltage interfaces — Mixed-voltage I/O support at the series level facilitates interfacing between different logic domains on the same board.
Unique Advantages
- Low-voltage, low-power design: Operates within a 1.14 V–1.575 V supply window and leverages series Flash*Freeze technology to minimize power consumption.
- Compact package footprint: 36-UCSP (3×3 mm) package and surface-mount construction reduce BOM size and PCB area for compact designs.
- Nonvolatile configuration: Flash-based architecture retains programmed design when power is removed, simplifying boot behavior and system design.
- Secure in-system programming: On-chip AES decryption and FlashLock capabilities (series-level) provide a path for protected updates and IP protection.
- Commercial temperature suitability: Rated for −20 °C to +85 °C operation, appropriate for a wide range of commercial embedded applications.
- Standards-conscious manufacturing: RoHS-compliant construction supports regulatory and manufacturing requirements.
Why Choose AGLN010V2-UCG36?
The AGLN010V2-UCG36 positions itself as a compact, low-power FPGA option within the IGLOO nano family for commercial embedded designs that need retained configuration, secure in-system programming, and mixed-voltage interface capability. With 260 logic elements, approximately 10,000 system gates, and a small 36-UCSP footprint, it is targeted at designers seeking a minimal-area programmable logic solution with flash-based nonvolatile behavior and low-voltage operation.
This device is suitable for engineers focusing on reduced power budgets, secure update paths, and tight board-space constraints. Its combination of reprogrammable flash, low standby power modes, and commercial temperature range delivers a straightforward, verifiable building block for a variety of embedded control and interface tasks.
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