AGLN010V2-UCG36

IC FPGA 23 I/O 36UCSP
Part Description

IGLOO nano Field Programmable Gate Array (FPGA) IC 23 260 36-WFBGA, CSPBGA

Quantity 1,069 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package36-UCSP (3x3)GradeCommercialOperating Temperature-20°C – 85°C
Package / Case36-WFBGA, CSPBGANumber of I/O23Voltage1.14 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs260Number of Logic Elements/Cells260
Number of Gates10000ECCN3A991DHTS Code8542.39.0001
QualificationN/A

Overview of AGLN010V2-UCG36 – IGLOO nano FPGA, 23 I/O, 260 logic elements

The AGLN010V2-UCG36 is an IGLOO nano field programmable gate array (FPGA) IC designed for low-power, small-footprint embedded logic tasks. It combines flash-based reprogrammable logic with low-voltage operation and security-capable in-system programming, making it suited for compact commercial applications that require retained configuration, mixed-voltage I/O flexibility, and minimal standby power.

Key Features

  • Logic Capacity — 260 logic elements (approximately 10,000 system gates) providing compact programmable logic for glue logic, protocol adaptation, and control functions.
  • I/O — 23 user I/Os in the 36-WFBGA / CSPBGA package, with series-level support for mixed-voltage I/Os across multiple banks.
  • Voltage Support — Core and I/O supply range specified from 1.14 V to 1.575 V for low-voltage system integration.
  • Low Power Operation — Series features include Flash*Freeze low-power mode and nanoPower consumption characteristics to minimize active and standby energy usage.
  • Reprogrammable Flash and Security — Flash-based FPGA fabric retains programmed design when powered off; supports in-system programming with on-chip AES decryption and FlashLock security mechanisms (series-level features).
  • Performance — Series-level system performance references up to 250 MHz at 1.5 V and 160 MHz at 1.2 V for appropriate devices and operating points.
  • Packaging and Mounting — Surface-mount device in 36-WFBGA / CSPBGA footprint; supplier device package 36-UCSP (3×3 mm) for minimal PCB area.
  • Operating Range and Compliance — Commercial grade with operating temperature range −20 °C to +85 °C and RoHS compliance.
  • On-chip Memory — This specific device reports 0 bits of on-chip SRAM; series includes small embedded FlashROM for user nonvolatile storage (series-level feature).

Typical Applications

  • Battery-powered and portable devices — Low-voltage operation and Flash*Freeze support reduce standby and active power for prolonged battery life.
  • Embedded control and glue logic — Compact logic capacity and 23 I/Os enable protocol adaptation, signal conditioning, and control tasks in space-constrained boards.
  • Secure in-field updates — Reprogrammable flash with AES-based in-system programming supports secure firmware and FPGA configuration updates.
  • Mixed-voltage interfaces — Mixed-voltage I/O support at the series level facilitates interfacing between different logic domains on the same board.

Unique Advantages

  • Low-voltage, low-power design: Operates within a 1.14 V–1.575 V supply window and leverages series Flash*Freeze technology to minimize power consumption.
  • Compact package footprint: 36-UCSP (3×3 mm) package and surface-mount construction reduce BOM size and PCB area for compact designs.
  • Nonvolatile configuration: Flash-based architecture retains programmed design when power is removed, simplifying boot behavior and system design.
  • Secure in-system programming: On-chip AES decryption and FlashLock capabilities (series-level) provide a path for protected updates and IP protection.
  • Commercial temperature suitability: Rated for −20 °C to +85 °C operation, appropriate for a wide range of commercial embedded applications.
  • Standards-conscious manufacturing: RoHS-compliant construction supports regulatory and manufacturing requirements.

Why Choose AGLN010V2-UCG36?

The AGLN010V2-UCG36 positions itself as a compact, low-power FPGA option within the IGLOO nano family for commercial embedded designs that need retained configuration, secure in-system programming, and mixed-voltage interface capability. With 260 logic elements, approximately 10,000 system gates, and a small 36-UCSP footprint, it is targeted at designers seeking a minimal-area programmable logic solution with flash-based nonvolatile behavior and low-voltage operation.

This device is suitable for engineers focusing on reduced power budgets, secure update paths, and tight board-space constraints. Its combination of reprogrammable flash, low standby power modes, and commercial temperature range delivers a straightforward, verifiable building block for a variety of embedded control and interface tasks.

Request a quote or submit an inquiry to obtain pricing and availability for AGLN010V2-UCG36. Include part number and required quantity to expedite your request.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1989


    Headquarters: Chandler, Arizona, USA


    Employees: 22,000+


    Revenue: $8.349 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D


    Featured Products
    Latest News
    keyboard_arrow_up