AGLN010V2-UCG36I

The AGLN010V2-UCG36I is an IGLOO nano field-programmable gate array (FPGA) IC from Microchip Technology. It provides 260 logic elements and approximately 10,000 gates in a compact 36-UCSP (3×3) package, delivering a small-footprint programmable logic option for space-constrained designs.

With 23 user I/Os, a supply voltage range of 1.14 V to 1.575 V, RoHS compliance, and industrial operating temperature rating, this device is suited to embedded systems and industrial applications that require reliable, reconfigurable logic in a surface-mount package.

Key Features

• Logic Capacity — 260 logic elements and 10,000 gates to implement small-scale programmable logic functions and custom control logic.
• I/O — 23 user I/O pins to handle signal interfacing and peripheral connections on compact boards.
• Memory — No on-chip RAM (Total RAM Bits: 0), enabling predictable resource planning for designs that use external memory or require minimal embedded memory.
• Power — Operates from 1.14 V to 1.575 V to match low-voltage system domains.
• Package & Mounting — 36-WFBGA / CSPBGA in a 36-UCSP (3×3) form factor; surface-mount for dense PCB assembly.
• Operating Range & Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C for extended-temperature deployments.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Embedded control and glue logic — Consolidate discrete logic and custom control functions on compact PCBs using the device's 260 logic elements and 23 I/Os.
• I/O consolidation for compact modules — 36-UCSP (3×3) packaging and surface-mount mounting support dense board layouts where board space is limited.
• Industrial instrumentation — Industrial-grade temperature range (−40 °C to 100 °C) enables use in monitoring and control equipment that requires extended-temperature operation.
• Prototyping and low-gate-count designs — Suitable for early development or production designs that need modest programmable logic capacity and a predictable resource footprint.

Unique Advantages

• Compact package footprint: 36-UCSP (3×3) package minimizes board area impact for space-constrained designs.
• Industrial temperature capability: Rated −40 °C to 100 °C to support deployment in harsher environments.
• Right-sized logic capacity: 260 logic elements and 10,000 gates provide a clear, predictable resource set for small-scale programmable logic tasks.
• Low-voltage operation: 1.14 V to 1.575 V supply range aligns with low-voltage system domains.
• Surface-mount ready: 36-WFBGA/CSPBGA form factor supports standard SMT assembly processes.
• Environmental compliance: RoHS status ensures alignment with common environmental requirements.

Why Choose AGLN010V2-UCG36I?

The AGLN010V2-UCG36I from Microchip Technology is positioned as a compact, industrial-grade FPGA option for designs that need modest programmable logic capacity with a small package footprint. Its combination of 260 logic elements, 23 I/Os, and a 36-UCSP surface-mount package makes it a practical choice for embedded control, I/O consolidation, and industrial instrumentation where space, temperature range, and low-voltage operation are important.

For engineers and procurement teams seeking a predictable, small-footprint FPGA with industrial operating range and RoHS compliance, the AGLN010V2-UCG36I offers a straightforward, manufacturable building block for long-term deployments backed by a recognized manufacturer.

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