AGLN010V5-UCG36I

The AGLN010V5-UCG36I is an IGLOO nano Field Programmable Gate Array (FPGA) IC from Microchip Technology, providing a compact reconfigurable logic element for embedded designs. With 260 logic elements and roughly 10,000 gates, this industrial-grade device addresses small-footprint control, interface and logic integration needs.

Packaged in a 36-WFBGA / CSPBGA (36-UCSP, 3×3) surface-mount package and rated for operation from -40°C to 100°C with a supply range of 1.425 V to 1.575 V, the device is targeted at applications that require a low-profile FPGA solution for deployment in temperature-demanding environments.

Key Features

• Core Architecture — IGLOO nano FPGA family device from Microchip Technology designed for configurable logic and embedded control.
• Logic Capacity — 260 logic elements providing approximately 10,000 gates for implementing control, glue logic, and small state machines.
• I/O — 23 I/O pins suitable for peripheral control, sensor interfacing and I/O aggregation in compact systems.
• Power and Voltage — Operates from a supply voltage range of 1.425 V to 1.575 V, enabling predictable integration with matched power rails.
• Package and Mounting — 36-WFBGA, CSPBGA in a 36-UCSP (3×3) footprint for compact surface-mount PCB designs.
• Temperature Range — Industrial-grade operating range from -40°C to 100°C for use in temperature-challenging applications.
• Compliance — RoHS compliant for environmental and manufacturing considerations.

Typical Applications

• Industrial Control — Implement small-scale control logic, state machines and timing functions in industrial equipment operating across wide temperatures.
• Sensor and I/O Interfaces — Aggregate and condition signals from multiple sensors or peripherals using the available 23 I/O pins in a compact package.
• Embedded Glue Logic — Replace discrete components with programmable logic to reduce BOM and simplify PCB routing for mixed-signal and digital systems.
• Compact Instrumentation — Integrate custom protocol handling or data preprocessing in space-constrained instrumentation thanks to the 3×3 UCSP package.

Unique Advantages

• Small PCB Footprint: The 36-UCSP (3×3) package delivers reconfigurable logic in a very compact surface-mount form factor, saving board space.
• Industrial Temperature Rating: Specified -40°C to 100°C operation supports deployment in demanding thermal environments.
• Right-Sized Logic Capacity: 260 logic elements and about 10,000 gates provide a focused resource set for glue logic, I/O management, and small control functions without excess complexity.
• Predictable Power Integration: Narrow supply range (1.425 V to 1.575 V) simplifies power-rail planning and component selection.
• Surface-Mount Ready: Designed for standard surface-mount assembly processes to support modern manufacturing workflows.
• RoHS Compliant: Meets common environmental compliance requirements for lead-free assembly.

Why Choose AGLN010V5-UCG36I?

The AGLN010V5-UCG36I positions itself as a compact, industrial-grade FPGA option for designers who need configurable logic in a small package with a clear operating-voltage and temperature envelope. Its combination of 260 logic elements, 23 I/O, and a 36-UCSP (3×3) footprint makes it well suited for embedded systems that require on-board programmability without large silicon or power overhead.

Backed by Microchip Technology, this IGLOO nano device is a suitable choice for teams targeting robust, space-efficient designs that benefit from reprogrammability, straightforward power requirements, and industrial temperature capability.

Request a quote or submit an inquiry to receive pricing and availability for the AGLN010V5-UCG36I and to discuss how it can fit into your next embedded design.