AGLN015V5-QNG68I

The AGLN015V5-QNG68I is an IGLOO nano Field Programmable Gate Array (FPGA) from Microchip Technology, provided in a 68-VFQFN exposed pad package. It offers a compact, industrial-grade configurable logic solution with defined electrical and thermal limits for reliable board-level integration.

With 384 logic elements and 49 I/O, this device is suited for applications that require low- to moderate-density programmable logic in a surface-mount QFN package, while operating across a wide industrial temperature range.

Key Features

• Logic Core 384 logic elements and approximately 15,000 gates provide the programmable fabric for custom logic functions.
• I/O Density 49 available I/O pins to interface with peripherals, sensors, and other on-board devices.
• On-chip Memory Total on-chip RAM: 0 bits (no embedded RAM).
• Power Core supply voltage specified at 1.425 V to 1.575 V for system power planning.
• Package & Mounting 68-VFQFN exposed pad package (supplier device package: 68-QFN, 8×8) designed for surface-mount assembly.
• Temperature & Grade Industrial-grade device rated for an operating temperature range of −40 °C to 100 °C.
• Environmental Compliance RoHS compliant for lead-free assembly and regulatory alignment.

Typical Applications

• Industrial Control — Implement control logic and finite-state machines that must operate across an industrial temperature range.
• Glue Logic & Interface Bridging — Provide custom signal routing, protocol adaptation, or timing adjustments between digital blocks using available logic elements and I/O.
• Sensor Aggregation & Preprocessing — Collect and condition multiple sensor signals with the device’s I/O count and programmable logic.
• Low-density Custom Logic and Prototyping — Rapidly prototype compact, application-specific logic functions in a surface-mount QFN package.

Unique Advantages

• Compact configurable logic: 384 logic elements and ~15,000 gates enable custom logic without large silicon footprints.
• Ample I/O for small systems: 49 I/O pins support multi-signal interfacing in compact designs.
• Industrial temperature rating: −40 °C to 100 °C grading supports deployment in temperature-demanding environments.
• QFN exposed pad package: 68-VFQFN (68-QFN, 8×8) offers a small board footprint and exposed pad for thermal and mechanical integration.
• Defined low-voltage supply: 1.425 V to 1.575 V core supply simplifies power budgeting for system design.
• RoHS compliant: Meets lead-free assembly requirements for compliant manufacturing.

Why Choose AGLN015V5-QNG68I?

The AGLN015V5-QNG68I positions itself as a compact, industrial-grade FPGA option for designers who need configurable logic with defined electrical and thermal specifications. Its combination of 384 logic elements, 49 I/O, and a 68-VFQFN exposed pad package makes it a practical choice for board-level applications requiring moderate logic density in a small surface-mount form factor.

Backed by Microchip Technology and supplied as a RoHS-compliant, industrial temperature-rated device, this FPGA is well suited to engineers and procurement teams seeking a reliable, space-efficient programmable-logic component for long-term product designs.

Request a quote or submit an inquiry today to get pricing and availability for the AGLN015V5-QNG68I.