AGLN020V2-QNG68

The AGLN020V2-QNG68 is an IGLOO nano Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides 520 logic elements and up to 49 general-purpose I/O in a compact 68‑VFQFN exposed pad surface-mount package.

Designed for designs that require a small, configurable logic device, the AGLN020V2-QNG68 operates from a 1.14 V to 1.575 V supply and is rated for commercial temperature operation from -20 °C to 85 °C. The device is RoHS compliant and supplied in a 68‑QFN (8×8) package with an exposed pad.

Key Features

• Core Logic 520 logic elements providing configurable logic capacity; equivalent to approximately 20,000 gates for implementing control and glue logic.
• I/O 49 general-purpose I/O pins for signal interfacing and peripheral connections.
• Memory No on-chip RAM (total RAM bits: 0); suited for designs that rely on external memory or primarily combinational/sequential logic.
• Power Supply Operates from 1.14 V to 1.575 V supply range to match target system voltage requirements.
• Package and Mounting 68‑VFQFN exposed pad package (supplier device package: 68‑QFN, 8×8 mm) in a surface-mount form factor for compact PCB layouts and thermal anchoring via the exposed pad.
• Temperature and Grade Commercial-grade device rated for operation from -20 °C to 85 °C.
• Compliance RoHS compliant for environmental and regulatory alignment.

Typical Applications

• Compact logic consolidation — Use to replace discrete glue logic and small CPLD functions where up to 520 logic elements meet system requirements.
• Interface bridging — Implement protocol adaptors or simple signal translation using the device’s 49 I/O pins in a small package footprint.
• Embedded control and state machines — Implement finite-state machines, control sequencers, and timing logic within a compact FPGA fabric.
• Space-constrained PCB designs — Surface-mount 68‑VFQFN package with exposed pad enables high-density layouts and improved thermal conduction on compact boards.

Unique Advantages

• Small, programmable logic in a compact package: 520 logic elements and 49 I/O in a 68‑VFQFN footprint simplifies board-level integration where PCB real estate is limited.
• Clear power interface: Wide operating supply range of 1.14 V to 1.575 V allows direct integration with low-voltage system rails.
• Predictable gate-equivalent capacity: Approximately 20,000 gates of logic capacity provides a straightforward sizing metric for consolidating discrete logic.
• Commercial-temperature rating: Rated for -20 °C to 85 °C operation to meet typical commercial embedded product requirements.
• RoHS compliant: Meets regulatory environmental requirements for lead-free assembly and global product acceptance.

Why Choose AGLN020V2-QNG68?

The AGLN020V2-QNG68 positions itself as a compact, configurable logic solution for designs that need moderate logic capacity and a moderate number of I/O in a small surface-mount package. Its combination of 520 logic elements, 49 I/O, and a 68‑VFQFN exposed pad package makes it suitable for consolidating glue logic, implementing control state machines, and fitting into tight PCB layouts.

Manufactured by Microchip Technology and supplied as a commercial-grade, RoHS-compliant device, the AGLN020V2-QNG68 is a straightforward choice for engineers seeking a predictable, small-footprint FPGA for board-level integration and prototyping where on-chip RAM is not required.

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