AGLN015V2-QNG68I

The AGLN015V2-QNG68I is an IGLOO nano Field Programmable Gate Array (FPGA) IC supplied in a 68‑lead VFQFN exposed‑pad package. It provides a compact, industrial‑grade programmable logic option with 384 logic elements and approximately 15,000 gates for low‑to‑moderate density designs.

Designed for surface‑mount assembly and operation from -40 °C to 100 °C, this device supports a core supply range of 1.14 V to 1.575 V and offers 49 user I/O, making it suitable for industrial embedded control and interface applications that require a small package footprint and RoHS compliance.

Key Features

• Core / Logic Density  384 logic elements delivering roughly 15,000 gates for compact programmable logic implementations.
• I/O Capability  49 available I/O pins to support multiple peripheral connections and signal interfacing.
• On‑Chip Memory  No embedded RAM (Total RAM Bits: 0), suitable for designs that use external memory or require pure combinational/sequential logic.
• Power  Core voltage supply range from 1.14 V to 1.575 V for integration into low‑voltage systems.
• Package & Mounting  68‑VFQFN exposed‑pad package (supplier device package 68‑QFN, 8×8) with surface‑mount mounting type for compact PCB designs and thermal pad options.
• Industrial Temperature & Grade  Rated for industrial operation with an operating temperature range of -40 °C to 100 °C.
• Compliance  RoHS compliant for environmentally conscious manufacturing.

Typical Applications

• Industrial Control  Implement glue logic, control state machines, and simple sequencing functions in industrial automation equipment using the device's industrial temperature rating and compact package.
• Embedded Interface Bridging  Use the 49 I/O lines to consolidate and adapt signals between sensors, actuators, and controllers in embedded systems.
• Instrumentation  Integrate deterministic logic and I/O routing for measurement and test instruments where a small FPGA footprint is required.

Unique Advantages

• Compact, exposed‑pad QFN package: Reduces PCB area while providing an accessible thermal pad for improved board‑level heat dissipation.
• Industrial temperature range: Rated from -40 °C to 100 °C for deployment in demanding environments.
• Balanced logic capacity: 384 logic elements and ~15,000 gates supply measurable programmable density without excessive device complexity.
• Generous I/O count: 49 I/O pins simplify peripheral integration and signal routing on compact boards.
• Low‑voltage operation: 1.14 V to 1.575 V supply range enables integration into modern low‑voltage power domains.
• RoHS compliance: Meets environmental regulations for lead‑free assembly.

Why Choose AGLN015V2-QNG68I?

The AGLN015V2-QNG68I delivers a pragmatic mix of programmable logic density, I/O flexibility, and industrial‑grade robustness in a compact 68‑lead VFQFN exposed‑pad package. Its 384 logic elements and approximately 15,000 gates make it well suited to designers who need reliable, small‑footprint programmable logic for embedded and industrial applications.

With RoHS compliance, surface‑mount packaging, and an extended operating temperature range, this part is positioned for deployment in production environments where board space, predictable logic capacity, and environmental compliance matter.

Request a quote or submit an inquiry today to discuss availability, pricing, and lead times for AGLN015V2-QNG68I. Our team can provide the details you need to move your design forward.