AGLE600V5-FGG256I

The AGLE600V5-FGG256I is an IGLOOe Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides 13,824 logic elements and 110,592 bits of embedded RAM in a compact 256-LBGA package.

With support for 165 I/O, an on-chip gate count of 600,000, industrial-grade temperature range, and a low-voltage core supply, this device is suited for applications that require programmable logic, moderate embedded memory, and broad I/O integration in industrial environments.

Key Features

• Core and Logic 13,824 logic elements (LEs) and approximately 600,000 gates provide programmable combinational and sequential resources for custom digital logic.
• Embedded Memory 110,592 bits of on-chip RAM (approximately 0.11 Mbits) for LUT, buffering, and small data storage needs.
• I/O Capacity 165 general-purpose I/O pins to support a wide range of peripheral interfacing and signal routing.
• Power Supply Core voltage range of 1.425 V to 1.575 V to match low-voltage system rails and support power-managed designs.
• Package & Mounting 256-LBGA (supplier device package: 256-FPBGA, 17 × 17) in a surface-mount format for compact board layouts and reliable solder attachment.
• Temperature Range Industrial operating temperature from −40 °C to 85 °C for deployment in temperature-variable environments.
• Compliance RoHS-compliant construction supporting environmental regulatory requirements.

Typical Applications

• Industrial control and automation — Use the FPGA’s logic elements and I/O capacity to implement custom control algorithms, state machines, and interface logic for industrial equipment operating across −40 °C to 85 °C.
• Embedded system integration — Provide glue logic, protocol conversion, and custom peripheral interfacing where 165 I/O lines and on-chip RAM are required.
• Prototyping and evaluation — Implement and validate custom digital functions and small embedded subsystems on a programmable device with a compact BGA footprint.

Unique Advantages

• Significant logic capacity: 13,824 logic elements enable substantial custom logic implementation without external ASICs or CPLDs.
• On-chip memory for buffering: Approximately 0.11 Mbits of embedded RAM supports LUTs, FIFOs, and temporary data storage directly on the device.
• Broad I/O availability: 165 I/O pins accommodate multiple peripherals, sensors, and actuators without complex external multiplexing.
• Industrial temperature rating: −40 °C to 85 °C operation supports deployment in harsh or temperature-variable environments.
• Compact BGA package: 256-LBGA (17 × 17 FPBGA) delivers a high-density solution for space-constrained PCBs with surface-mount assembly.
• Low-voltage core operation: 1.425 V to 1.575 V core supply helps align the FPGA with modern low-voltage systems.

Why Choose AGLE600V5-FGG256I?

The AGLE600V5-FGG256I combines a mid-range logic element count, on-chip RAM, and a substantial I/O complement in an industrial-grade, surface-mount BGA package from Microchip Technology. This combination makes it suitable for designs that require programmable digital logic, local buffering, and flexible interfacing under industrial temperature conditions.

For engineers and procurement teams seeking a reliable, RoHS-compliant FPGA option with clear electrical and thermal parameters—13,824 logic elements, 110,592 bits of RAM, 165 I/O, 600,000 gates, 1.425–1.575 V core, and −40 °C to 85 °C operation—the AGLE600V5-FGG256I offers a focused solution for scalable, maintainable designs.

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