AGL600V5-FGG256

IC FPGA 177 I/O 256FBGA
Part Description

IGLOO Field Programmable Gate Array (FPGA) IC 177 110592 13824 256-LBGA

Quantity 184 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 70°C
Package / Case256-LBGANumber of I/O177Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs13824Number of Logic Elements/Cells13824
Number of Gates600000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits110592

Overview of AGL600V5-FGG256 – IGLOO Field Programmable Gate Array (FPGA), 13,824 logic elements

The AGL600V5-FGG256 is an IGLOO field programmable gate array (FPGA) from Microchip Technology designed for commercial embedded designs. It integrates 13,824 logic elements with on-chip memory and a broad complement of I/O to enable flexible hardware customization.

With approximately 600,000 gates, 110,592 bits of embedded RAM, and support for 177 I/O signals in a compact 256-LBGA package, this device targets designers who need reprogrammable logic, moderate embedded memory, and dense I/O in a surface-mount form factor.

Key Features

  • Programmable Logic – 13,824 logic elements provide a versatile fabric for custom digital logic implementation and hardware acceleration.
  • Gate Capacity – Approximately 600,000 gates to support complex combinational and sequential functions within commercial designs.
  • Embedded Memory – Approximately 0.11 Mbits (110,592 bits) of on-chip RAM for buffering, state storage, and small data tables.
  • I/O Density – 177 general-purpose I/O pins to interface with peripherals, sensors, and external devices.
  • Power Supply – Single-core voltage range from 1.425 V to 1.575 V to match system power rails and logic-level requirements.
  • Package and Mounting – 256-LBGA (supplier package: 256-FPBGA 17×17) in a surface-mount package for compact PCB integration.
  • Operating Range – Commercial temperature grade rated from 0 °C to 70 °C for standard commercial-environment applications.
  • Compliance – RoHS-compliant construction for environmental and manufacturing compatibility.

Typical Applications

  • Commercial Embedded Systems – Implement custom control logic, protocol handling, or glue logic in compact consumer and industrial products operating within commercial temperature ranges.
  • Interface and I/O Expansion – Use the device’s 177 I/O pins to consolidate multiple peripheral interfaces or bridge mixed-signal subsystems.
  • Signal Processing and Control – Deploy the programmable fabric and on-chip RAM for deterministic control loops, data buffering, and lightweight packet processing.
  • Prototyping and Functional Validation – Rapidly iterate hardware functions and proof-of-concept designs where reprogrammability and moderate logic capacity are required.

Unique Advantages

  • High Logic Integration: 13,824 logic elements and ~600,000 gates let you consolidate logic that would otherwise require multiple discrete devices.
  • Embedded Memory Availability: Approximately 0.11 Mbits of on-chip RAM reduces dependence on external memory for small buffers and state machines.
  • Dense I/O Count: 177 I/O pins provide flexibility to manage numerous peripherals and interfaces without additional I/O expanders.
  • Compact, Surface-Mount Package: 256-LBGA (256-FPBGA 17×17) enables a small PCB footprint while maintaining robust pin count for complex designs.
  • Commercial Temperature Grade: Rated 0 °C to 70 °C to match typical commercial product environments.
  • Regulatory Compatibility: RoHS compliance supports streamlined manufacturing and environmental requirements.

Why Choose AGL600V5-FGG256?

The AGL600V5-FGG256 positions itself as a practical, high-density FPGA choice for commercial embedded designs that require substantial programmable logic, on-chip memory, and a large number of I/Os in a compact surface-mount package. Its voltage and temperature specifications make it straightforward to integrate into standard commercial systems.

Engineers designing firmware-driven hardware, interface bridges, or consolidated control systems will find the combination of logic capacity, embedded RAM, and I/O density useful for reducing component count and simplifying board routing while leveraging Microchip Technology’s IGLOO FPGA family attributes.

Request a quote or submit an inquiry to receive pricing and availability information for the AGL600V5-FGG256.

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