AGL600V5-CSG281I
| Part Description |
IGLOO Field Programmable Gate Array (FPGA) IC 215 110592 13824 281-TFBGA, CSBGA |
|---|---|
| Quantity | 852 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 281-CSP (10x10) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 281-TFBGA, CSBGA | Number of I/O | 215 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 13824 | Number of Logic Elements/Cells | 13824 | ||
| Number of Gates | 600000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 110592 |
Overview of AGL600V5-CSG281I – IGLOO Field Programmable Gate Array (FPGA), 281-TFBGA
The AGL600V5-CSG281I is an IGLOO family flash FPGA from Microchip Technology in a 281-TFBGA (CSBGA) surface-mount package. It delivers a reprogrammable, single-chip FPGA solution with the low-power and instant-on characteristics described in the IGLOO family datasheet.
Designed for industrial-grade embedded designs, the device combines logic capacity, on-chip memory, and flexible I/O to address low-power system control, I/O expansion, and compact FPGA integration requirements.
Key Features
- Logic Capacity — 13,824 logic elements with an equivalent of approximately 600,000 system gates, enabling mid-density logic integration on a single device.
- Embedded Memory — 110,592 bits of on-chip RAM (approximately 0.11 Mbits) for user data and buffering needs.
- I/O — 215 user I/Os to support multiple peripheral interfaces and mixed-signal connectivity.
- Nonvolatile Flash — IGLOO family flash-based architecture provides reprogrammable nonvolatile storage and Instant On behavior; family devices include on-chip reprogrammable FlashROM for configuration and storage.
- Low-Power Modes — Family-level Flash*Freeze ultra-low power mode (as low as 5 μW) and Low Power Active operation (from 12 μW) for minimal standby and active power consumption.
- Clocking and Timing — IGLOO family clock conditioning circuitry with multiple CCC blocks and an integrated PLL option for flexible clock generation and conditioning.
- Advanced I/O Standards — Family supports mixed-voltage I/O operation (1.2V, 1.5V, 1.8V, 2.5V, 3.3V) and wide I/O supply ranges per the IGLOO datasheet; includes I/O registers and programmable drive/slew controls.
- Package & Mounting — 281-TFBGA (CSBGA) surface-mount package; supplier device package noted as 281-CSP (10×10).
- Power and Temperature — Core supply range specified at 1.425 V to 1.575 V; industrial operating temperature range from −40°C to 85°C.
- Security & In-System Programming — IGLOO family supports ISP with on-chip 128-bit AES decryption via JTAG (except ARM-enabled IGLOO devices), and FlashLock® functionality to protect configured contents.
- Compliance — RoHS compliant.
Typical Applications
- Industrial Control — Mid-density logic and 215 I/Os support control, monitoring, and deterministic interfacing in industrial automation modules operating across −40°C to 85°C.
- Low-Power Embedded Systems — Flash*Freeze and Low Power Active capabilities allow extended battery or standby life for embedded controllers and portable instrumentation.
- Interface Bridge and I/O Expansion — High I/O count and mixed-voltage support enable level translation, protocol bridging, and expansion of I/O capabilities in system boards.
- Compact System Integration — Reprogrammable flash configuration and a 281-TFBGA footprint enable single-chip consolidation where board space and instant-on behavior matter.
Unique Advantages
- Highly integrated logic and memory: 13,824 logic elements with ~600k system gates and on-chip RAM provide a compact implementation platform that reduces external components.
- Nonvolatile, reprogrammable configuration: Flash-based IGLOO architecture retains programmed design when powered off and supports in-system reprogramming.
- Ultra-low power standby: Flash*Freeze and Low Power Active modes enable µW-class retention and minimal active power draw for power-sensitive designs.
- Flexible I/O and clocking: Bank-selectable mixed-voltage I/Os, I/O registers, and multiple clock conditioning blocks (one with PLL) simplify interfacing and timing management.
- Industrial temperature range: Specified operation from −40°C to 85°C suits deployment in a broad set of industrial environments.
- Compliance and manufacturability: Surface-mount 281-TFBGA packaging and RoHS compliance support standard manufacturing processes and regulatory requirements.
Why Choose AGL600V5-CSG281I?
The AGL600V5-CSG281I brings IGLOO family strengths—flash nonvolatile configuration, low-power modes, and flexible I/O—into an industrial-grade FPGA package. With 13,824 logic elements, approximately 0.11 Mbits of on-chip RAM, 215 I/Os, and a 281-TFBGA footprint, it is positioned for designers who need mid-density programmable logic with low standby power and reliable operation across industrial temperature ranges.
Manufactured by Microchip Technology and built on the IGLOO flash-FPGA architecture, this device is appropriate for compact embedded systems, I/O-heavy controllers, and designs that require reprogrammability combined with ultra-low power retention and secure in-system programming options.
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