AGL600V2-FGG256I

The AGL600V2-FGG256I is an industrial-grade IGLOO family flash FPGA in a 256-LBGA surface-mount package. It combines nonvolatile flash-based configuration with low-power operation and on-chip memory to support compact, reprogrammable system designs.

With 13,824 logic elements, approximately 0.11 Mbits of embedded RAM (110,592 total RAM bits), 177 I/Os and roughly 600,000 system gates, this device targets low-power, high-density systems that require retained configuration, rapid wake-up and flexible I/O voltage support across a 1.14 V to 1.575 V supply range and operation from -40 °C to 85 °C.

Key Features

• Logic Capacity 13,824 logic elements (13,824 logic elements) and approximately 600,000 system gates provide substantial programmable capacity for mid-range FPGA designs.
• Embedded Memory 110,592 total RAM bits — approximately 0.11 Mbits of on-chip SRAM — for data buffering and application state storage.
• I/O Count & Flexibility 177 user I/Os in a 256-LBGA footprint, supporting mixed-voltage system integration and flexible external interfacing.
• Low-Power Modes Flash*Freeze ultra-low power mode that can consume as little as 5 μW while retaining SRAM and register data, plus Low Power Active capability (from 12 μW) for functional, low-power system operation.
• Nonvolatile Configuration Flash-based FPGA fabric with on-chip reprogrammable FlashROM for instant-on behavior and retained programmed design when powered off.
• Clocking & System Performance Integrated clock conditioning circuitry and PLL capability as part of the IGLOO family architecture to support system timing needs and recover quickly from low-power states.
• Power & Environmental Core and I/O operation within a 1.14 V to 1.575 V supply window and an industrial operating temperature range of -40 °C to 85 °C; RoHS compliant.
• Package & Mounting 256-LBGA (supplier package 256-FPBGA, 17×17) in a surface-mount format suitable for compact PCB layouts.
• In-System Programming & Security IGLOO family supports ISP with on-chip 128-bit AES decryption (where applicable) and FlashLock features for securing FPGA contents as described in the series documentation.

Typical Applications

• Industrial Control Programmable logic for control loops, human-machine interfaces and system monitoring where industrial temperature range and low power retention are required.
• Low-Power Embedded Systems Battery- or energy-constrained applications that benefit from Flash*Freeze and Low Power Active modes to extend system standby time while retaining state.
• System Power Management On-device control of power sequencing and monitoring, leveraging retained configuration and ultra-low-power wake/sleep transitions.
• High-Density Logic Integration Compact, reprogrammable logic for consolidating functions and reducing BOM in space-constrained designs using the 256-LBGA package.

Unique Advantages

• Nonvolatile, Instant-On Operation: Flash-based configuration retains programmed design when powered off, enabling immediate system start-up without external configuration memory.
• Ultra-Low Power Retention: Flash*Freeze mode with micro-watt-level draw preserves SRAM and register data, simplifying power-management strategies in low-energy systems.
• Balanced Capacity and I/O: 13,824 logic elements combined with 177 I/Os provide a strong balance of programmable logic and peripheral connectivity for mid-range designs.
• Industrial-Grade Robustness: Specified operation from -40 °C to 85 °C and RoHS compliance supports deployment in demanding operating environments.
• Compact Package: 256-LBGA (17×17 FPBGA) surface-mount footprint enables dense PCB integration while maintaining ample I/O.
• Integrated Clocking & Security Options: On-chip clock conditioning/PLL blocks and family-level ISP/AES security features help streamline system design and secure in-field updates.

Why Choose AGL600V2-FGG256I?

The AGL600V2-FGG256I delivers a practical combination of logic capacity, embedded memory and I/O density in an industrial-grade, flash-configurable FPGA. Its low-power Flash*Freeze and Low Power Active modes, together with nonvolatile instant-on capability, make it a strong fit for systems that require retained configuration and aggressive power management.

This device is well suited for design teams building mid-range embedded and industrial systems that need reprogrammability, retained state across power cycles, and a compact surface-mount package. Its measurable specs—13,824 logic elements, ~0.11 Mbits of on-chip RAM, 177 I/Os, 600,000 system gates, 1.14–1.575 V supply range and -40 °C to 85 °C operation—provide clear design parameters for integration and long-term deployment.

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