AGL600V2-FG256I

The AGL600V2-FG256I is an IGLOO Field Programmable Gate Array (FPGA) IC designed for industrial applications. It provides a programmable logic fabric with 13,824 logic elements and approximately 600,000 gates, combined with a substantial I/O count and embedded memory for compact, configurable designs.

With low-voltage operation and an industrial temperature rating, this device targets systems that require configurable logic and robust operating margins in surface-mount 256-LBGA packaging.

Key Features

• Logic Capacity  13,824 logic elements (equivalent to approximately 600,000 gates) for implementing mid-density programmable logic and custom digital functions.
• Embedded Memory  Approximately 0.11 Mbits of on-chip RAM (110,592 bits) to support buffering, state machines, and small data structures within the FPGA fabric.
• I/O Resources  177 available I/O pins to connect multiple peripherals, sensors, or external devices directly to the programmable fabric.
• Voltage Supply  Operates over a core supply range of 1.14 V to 1.575 V, supporting low-voltage system architectures.
• Package and Mounting  Surface-mount 256-LBGA package; supplier package listed as 256-FPBGA (17 × 17) for compact board-level integration.
• Industrial Temperature Grade  Rated for operation from −40°C to 85°C, suitable for industrial environments.
• Regulatory Compliance  RoHS compliant to meet lead-free and environmental requirements.

Typical Applications

• Industrial Control  Programmable logic for industrial equipment and control systems, leveraging the device's industrial temperature rating and configurable resources.
• Embedded Systems  On-board implementation of custom logic and peripheral interfaces using 13,824 logic elements and 177 I/Os.
• Interface Bridging and Custom I/O  Use the available I/O and internal logic to create protocol translators, glue logic, or custom interface functions within a compact LBGA footprint.

Unique Advantages

• High logic density: 13,824 logic elements and roughly 600,000 gates provide ample resources for mid-scale FPGA designs without external glue logic.
• Compact package integration: 256-LBGA (256-FPBGA, 17 × 17) packaging enables dense board layouts while maintaining a high I/O count.
• Low-voltage operation: Core supply range of 1.14 V to 1.575 V supports low-power system architectures and modern supply domains.
• Industrial-grade reliability: Rated for −40°C to 85°C operation, suitable for deployments in industrial environments.
• On-chip memory: Approximately 0.11 Mbits of embedded RAM reduces the need for external memory for small buffers and state storage.
• Compliance-ready: RoHS compliance supports environmentally driven design and manufacturing requirements.

Why Choose AGL600V2-FG256I?

The AGL600V2-FG256I positions itself as a mid-density, industrial-grade FPGA offering a balance of logic capacity, on-chip memory, and a high I/O count in a compact 256-LBGA package. Its low-voltage core range and industrial temperature rating make it a practical choice for engineers designing configurable logic into industrial and embedded systems where board space and environmental robustness matter.

This device is suited for design teams that need deterministic programmable logic resources, flexible I/O, and compact packaging to simplify system architecture and reduce external component count.

Request a quote or submit an inquiry to get pricing and availability information for AGL600V2-FG256I.