AGL600V2-FG144

The AGL600V2-FG144 is an IGLOO field programmable gate array (FPGA) IC designed for commercial-grade embedded logic applications. It integrates 13,824 logic elements, approximately 110,592 bits of on-chip RAM, and 97 I/O pins in a compact 144-LBGA package to enable custom digital functions and interface consolidation in space-constrained boards.

This device targets designs that require mid-density programmable logic with on-chip memory and a substantial I/O count while maintaining surface-mount assembly and commercial temperature operation.

Key Features

• Logic Capacity 13,824 logic elements and approximately 600,000 gates provide a mid-density fabric for implementing custom state machines, datapaths, and glue logic.
• On-Chip Memory 110,592 bits of total RAM (~0.11 Mbits) for embedded buffering, FIFOs, and small lookup tables without external memory.
• I/O Resources 97 general-purpose I/O pins to support multiple interfaces and peripheral connections directly from the FPGA package.
• Power Supply Operates from a core voltage supply range of 1.14 V to 1.575 V to match target board power architectures.
• Package and Mounting Surface-mount 144-LBGA package (supplier device package: 144-FPBGA, 13×13 mm) for dense board layouts and automated assembly.
• Commercial Temperature Grade Rated for operation from 0°C to 70°C for a wide range of standard commercial applications.
• Regulatory RoHS compliant to support lead-free assembly and environmental requirements.

Typical Applications

• Custom Logic and Prototyping Implement custom finite state machines, glue logic, and prototyping functions using the 13,824 logic elements and 600k-gate capacity.
• I/O Aggregation and Interface Bridging Use the 97 I/O pins to consolidate multiple peripheral interfaces or bridge between different board subsystems.
• On-Chip Data Buffering Leverage the 110,592 bits of embedded RAM for small buffering, FIFOs, or lookup tables without external memory.
• Compact Board Designs The 144-LBGA surface-mount package supports high-density PCB layouts where package size and pin count are critical.

Unique Advantages

• Balanced Logic and Memory: 13,824 logic elements paired with ~0.11 Mbits of RAM enable balanced implementations of control and data-path functions on a single device.
• Substantial I/O Count: 97 I/O pins reduce the need for external multiplexers, simplifying board-level routing and component count.
• Compact, Assembly-Friendly Package: 144-LBGA (144-FPBGA 13×13) supports automated surface-mount assembly and dense PCB placement.
• Commercial Temperature Rating: Designed for standard commercial environments (0°C to 70°C), aligning with common embedded and consumer applications.
• RoHS Compliant: Facilitates lead-free manufacturing and compliance with environmental regulations.

Why Choose AGL600V2-FG144?

The AGL600V2-FG144 delivers a mid-density FPGA option that combines a substantial logic element count, on-chip RAM, and a high I/O count in a compact 144-LBGA surface-mount package. Its electrical and mechanical attributes make it suitable for commercial embedded designs that require integrated logic, modest memory, and interface flexibility.

This device is appropriate for design teams seeking to consolidate glue logic, implement custom protocols, or add flexible control logic while keeping board area and BOM complexity under control. Its RoHS compliance and standard commercial temperature rating support streamlined production and deployment in a variety of commercial applications.

Request a quote or submit a purchase inquiry to obtain pricing and availability for the AGL600V2-FG144. Our team will respond with lead-time and ordering details tailored to your project needs.