AGL600V2-CS281I

The AGL600V2-CS281I is an IGLOO field programmable gate array (FPGA) designed for industrial applications that require a balance of logic capacity, on-chip memory, and high I/O count. It provides 13,824 logic elements and approximately 0.11 Mbits of embedded memory to implement custom digital functions, interface glue logic, and control systems.

Packaged in a 281-TFBGA (281-CSP, 10×10) surface-mount package and specified for operation from −40 °C to 85 °C, this FPGA is suited to designs that need a compact footprint with broad I/O connectivity and defined supply-voltage operation.

Key Features

• Logic Capacity — 13,824 logic elements (cells) and an estimated 600,000 gates to implement complex custom logic and state machines.
• On‑Chip Memory — 110,592 bits of embedded RAM, providing local storage for buffering, lookup tables, and small data structures.
• I/O Integration — 215 user I/O pins to support multiple interfaces, sensor connections, and external peripheral control.
• Power Supply Range — Operates from 1.14 V to 1.575 V to match target system power rails and enable predictable power-domain design.
• Package & Mounting — 281-TFBGA (281-CSP, 10×10) surface-mount package for dense board layouts and automated PCB assembly.
• Industrial Temperature — Rated for operation from −40 °C to 85 °C, suitable for a wide range of industrial environments.
• RoHS Compliant — Conforms to RoHS requirements for lead-free assembly and regulatory compliance.

Typical Applications

• Industrial Control — Use the device’s 13,824 logic elements and 215 I/O pins to implement custom control logic, I/O aggregation, and sensor interfacing for factory automation and instrumentation.
• Embedded Processing Glue — Implement protocol bridging, bus interfacing, and peripheral control where compact board footprint and substantial I/O are required.
• Signal Conditioning and Preprocessing — Leverage on‑chip RAM for local buffering and the available gates for pre-processing of digital sensor data before passing to a host processor.

Unique Advantages

• High Logic Density: 13,824 logic elements deliver substantial on-chip programmable logic for implementing complex state machines and custom datapaths.
• Significant Embedded Memory: Approximately 0.11 Mbits of RAM supports buffering, FIFOs, and lookup storage without external memory.
• Extensive I/O Count: 215 I/O pins enable broad connectivity to sensors, actuators, and peripheral devices, reducing the need for external multiplexing.
• Compact, Surface‑Mount Package: The 281-TFBGA (281-CSP, 10×10) package allows dense PCB integration and supports automated assembly processes.
• Industrial Temperature Range: Rated from −40 °C to 85 °C for deployment in a wide variety of industrial operating environments.
• Controlled Supply Voltage Range: Specified operation between 1.14 V and 1.575 V assists in predictable power-domain planning for system designers.

Why Choose AGL600V2-CS281I?

The AGL600V2-CS281I IGLOO FPGA combines a substantial logic element count, embedded RAM, and a high I/O complement in a compact 281-TFBGA surface-mount package. Its industrial temperature rating and defined supply-voltage range make it a practical choice for engineers building reliable embedded control, interface, and preprocessing functions where board space and I/O density matter.

This device is aimed at teams that need scalable programmable logic capacity with on-chip memory and robust I/O in a compact form factor, delivering long-term value through flexible hardware programmability and integration into industrial systems.

Request a quote or submit a quote inquiry to evaluate the AGL600V2-CS281I for your next design and to receive pricing and availability information.