AGL400V5-FG256I

The AGL400V5-FG256I is an industrial-grade IGLOO flash FPGA from Microchip Technology in a 256-LBGA package. It provides 9,216 logic elements and approximately 55,296 bits of embedded RAM in a low-power, surface-mount form factor. This device is suited for compact, power-conscious designs requiring reprogrammable logic, mid-range gate capacity, and extended temperature operation.

Key Features

• Logic Capacity — 9,216 logic elements (cells) enabling mid-density programmable logic integration for control, glue-logic, and protocol bridging functions.
• Embedded Memory — 55,296 total RAM bits of on-chip memory (approximately 0.055 Mbits) to support state storage, FIFOs, and small buffers.
• I/O Count & Voltage — 178 user I/Os with mixed-voltage operation supported by the IGLOO family; core supply for this part is specified at 1.425 V to 1.575 V.
• Power Efficiency — IGLOO family Flash*Freeze and Low Power Active capabilities (series-level) enable ultra-low standby and active power modes, including flash-retention modes consuming as little as 5 μW and low-power active operation from 12 μW.
• Performance — IGLOO series performance levels include system operation up to 250 MHz at 1.5 V and 160 MHz at 1.2 V (series specification).
• Package & Mounting — 256-LBGA / supplier device package 256-FPBGA (17 × 17), surface-mount for compact board-level integration.
• Industrial Temperature Range — Rated for operation from −40 °C to +85 °C for reliability in industrial environments.
• Nonvolatile, Reprogrammable — IGLOO flash-based architecture retains programmed design when powered off, enabling instant-on behavior and in-system reprogramming capabilities (series-level features).
• Compliance — RoHS compliant.

Typical Applications

• Industrial Control — Implement custom logic for motor control, PLC interfaces, or timing-critical supervisory tasks while meeting industrial temperature requirements.
• Embedded System Glue Logic — Replace multiple discrete components with programmable logic for protocol bridging, bus arbitration, and peripheral interfacing.
• Low-Power Instrumentation — Use ultra-low power modes to manage sensor scanning and system wake-up with minimal standby energy.
• Communications & I/O Expansion — Add protocol adapters and I/O expansion for mid-density systems using the device’s 178 user I/Os.

Unique Advantages

• Highly Integrated Mid-Density Fabric — 9,216 logic elements and embedded RAM reduce external components and simplify board design for mid-range applications.
• Low Power Operation — Family-level Flash*Freeze and Low Power Active capabilities enable aggressive power management strategies for battery- or energy-sensitive systems.
• Industrial Reliability — Specified operating range of −40 °C to +85 °C meets common industrial environment requirements.
• Compact Surface-Mount Packaging — 256-LBGA (17 × 17) provides a small footprint option for space-constrained PCBs while maintaining a high I/O count.
• Nonvolatile Configuration — Flash-based architecture preserves programmed designs without requiring external configuration memory, enabling instant-on functionality.

Why Choose AGL400V5-FG256I?

The AGL400V5-FG256I positions itself as a practical, industrial-grade FPGA option for designers who need mid-range programmable logic with low-power operation and nonvolatile configuration. Its combination of 9,216 logic elements, roughly 55 kb of embedded RAM, and 178 I/Os in a compact 256-LBGA package makes it suitable for embedded control, interface consolidation, and low-power instrumentation projects.

For teams seeking a reprogrammable, flash-based FPGA with industrial temperature capability and a focus on power-sensitive designs, the AGL400V5-FG256I delivers a balanced mix of capacity, efficiency, and board-space economy backed by the IGLOO family feature set.

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