AGL400V5-FGG256

The AGL400V5-FGG256 is an IGLOO Field Programmable Gate Array (FPGA) from Microchip Technology built in a 256-LBGA package. It provides a fixed set of on-chip resources including approximately 9,216 logic elements, roughly 55,296 bits of embedded RAM, and up to 178 user I/O pins.

Designed for surface-mount assembly and commercial-grade applications, this device operates from a 1.425 V to 1.575 V supply and across an ambient temperature range of 0 °C to 70 °C. The part is RoHS compliant.

Key Features

• Core Approximately 9,216 logic elements (cells) enabling implementation of custom digital logic and moderate-complexity designs.
• Embedded Memory Approximately 55,296 bits of on-chip RAM for local buffering, state storage, and small data tables.
• I/O and Gate Count Up to 178 user I/O pins and an equivalent of about 400,000 gates to support flexible interfacing and logic capacity.
• Power Narrow supply range of 1.425 V to 1.575 V to match system power-rail planning and ensure predictable device power requirements.
• Package & Mounting 256-LBGA (supplier package listed as 256-FPBGA, 17×17) in a surface-mount form factor for compact board integration.
• Temperature & Grade Commercial grade operation from 0 °C to 70 °C for standard embedded and consumer applications.
• Compliance RoHS compliant for environmentally controlled manufacturing and regulatory alignment.

Typical Applications

• Custom digital logic Implement core state machines and glue logic using approximately 9,216 logic elements and up to 178 I/O for device interfacing.
• Embedded buffering and small memory tables Use the roughly 55,296 bits of on-chip RAM for local data buffering, FIFO staging, and small lookup tables.
• Interface consolidation Consolidate multiple I/O functions in a single 256-LBGA package while maintaining a compact PCB footprint.

Unique Advantages

• Balanced logic and memory resources: The combination of ~9,216 logic elements and ~55,296 bits of embedded RAM supports a wide range of mid-complexity designs without external memory for small datasets.
• High I/O count: Up to 178 user I/O pins provide flexibility for connecting multiple peripherals, buses, or sensors directly to the FPGA fabric.
• Compact, manufacturable package: The 256-LBGA (256-FPBGA, 17×17) surface-mount package enables dense board layouts and automated assembly.
• Predictable power requirements: A defined supply range (1.425 V–1.575 V) simplifies power-supply planning and margin analysis.
• Commercial-grade suitability: Rated for 0 °C to 70 °C operation and RoHS compliant for mainstream embedded and consumer applications.

Why Choose AGL400V5-FGG256?

The AGL400V5-FGG256 positions itself as a compact, mid-capacity FPGA option for designs that need a balance of logic density, on-chip RAM, and a high I/O count in a surface-mount LBGA package. Its defined voltage range and commercial temperature rating make it suitable for standard embedded applications where predictable electrical and thermal behavior is required.

Manufactured by Microchip Technology and offered in a 256-LBGA footprint, this device is appropriate for engineers and procurement teams building board-level solutions that require moderate logic resources, local memory, and flexible interfacing while maintaining RoHS compliance.

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