AGL400V5-CSG196
| Part Description |
IGLOO Field Programmable Gate Array (FPGA) IC 143 55296 9216 196-TFBGA, CSBGA |
|---|---|
| Quantity | 99 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 196-CSP (8x8) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 196-TFBGA, CSBGA | Number of I/O | 143 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 9216 | Number of Logic Elements/Cells | 9216 | ||
| Number of Gates | 400000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 55296 |
Overview of AGL400V5-CSG196 – IGLOO FPGA, 9,216 Logic Elements, 143 I/O
The Microchip Technology AGL400V5-CSG196 is an IGLOO field programmable gate array (FPGA) offered in a 196-TFBGA (CSBGA) package. It provides reconfigurable digital logic with 9,216 logic elements, roughly 400,000 gates and on-chip RAM for compact, board-level integration.
Designed for commercial-grade applications, this surface-mount FPGA supports designs that require moderate logic capacity, a high I/O count and a narrow core supply range of 1.425 V to 1.575 V. Operating temperature is specified from 0 °C to 70 °C and the device is RoHS compliant.
Key Features
- Logic Capacity — 9,216 logic elements providing up to 400,000 gates of configurable digital logic for implementing custom functions.
- On-Chip Memory — 55,296 bits of embedded RAM (approximately 0.055 Mbits) for local data storage and buffering.
- I/O Count — 143 user I/O pins to support multiple external interfaces and peripheral connections on a single device.
- Power — Core/primary voltage supply range of 1.425 V to 1.575 V to match targeted power-rail designs.
- Package & Mounting — 196-TFBGA (CSBGA) package, supplier device package 196-CSP (8×8), intended for surface-mount assembly.
- Operating Conditions & Grade — Commercial grade with an operating temperature range of 0 °C to 70 °C.
- Environmental Compliance — RoHS compliant to meet common regulatory requirements for lead-free assembly.
Typical Applications
- Custom Logic and Prototyping — Implement and iterate digital logic functions using the device's 9,216 logic elements and on-chip RAM for temporary storage during development.
- I/O-Intensive Control — Use the 143 I/O pins to aggregate and manage multiple digital peripherals and interface signals at the board level.
- Embedded System Integration — Integrate application-specific logic and buffering into compact surface-mount designs taking advantage of the 196-TFBGA package.
Unique Advantages
- Balanced Logic and Memory: 9,216 logic elements combined with 55,296 bits of embedded RAM provides a balanced resource mix for mid-range configurable designs.
- High I/O Density: 143 available I/O pins enable multi-signal interfacing without external multiplexing, reducing board complexity.
- Compact Surface-Mount Package: 196-TFBGA (196-CSP 8×8) packaging supports dense PCB layouts and automated assembly processes.
- Clear Supply Requirements: A defined voltage supply range (1.425 V to 1.575 V) simplifies power-rail planning and integration.
- Commercial-Grade Specification: Specified operating range of 0 °C to 70 °C matches typical commercial electronics deployments.
- Regulatory Compliance: RoHS compliance supports lead-free production flows and common environmental requirements.
Why Choose AGL400V5-CSG196?
The AGL400V5-CSG196 positions itself as a practical, commercially graded FPGA for designs that require a moderate amount of configurable logic, substantial I/O, and on-chip RAM in a compact surface-mount package. Its explicit resource counts—9,216 logic elements, 143 I/O and 55,296 bits of RAM—make it straightforward to evaluate against application needs.
This device suits teams focused on board-level integration where package footprint, I/O density and a well-defined power envelope are important. Choosing this FPGA provides predictable hardware resources and RoHS compliance for streamlined production planning.
Request a quote or submit an inquiry to discuss availability, pricing and lead times for the AGL400V5-CSG196.

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