AGL400V2-FGG256I

The AGL400V2-FGG256I is an IGLOO Field Programmable Gate Array (FPGA) IC provided in a 256-LBGA package. It delivers 9,216 logic elements, approximately 55 kbits of embedded memory, and 178 I/Os, making it suitable for space-constrained industrial designs requiring moderate logic capacity and on-chip RAM.

Key device characteristics include an industrial operating temperature range from -40°C to 85°C, surface-mount 256-LBGA packaging (supplier package: 256-FPBGA, 17×17), RoHS compliance, and a core voltage supply range of 1.14 V to 1.575 V.

Key Features

• Core Logic 9,216 logic elements (cells) and a gate equivalent of 400,000 gates provide deterministic programmable logic resources for custom digital functions.
• Embedded Memory Approximately 55 kbits of on-chip RAM for buffering, small-scale data storage, and state retention within the FPGA fabric.
• I/O Capability 178 I/Os to support multiple external interfaces and peripheral connections from a single device footprint.
• Package & Mounting 256-LBGA (supplier: 256-FPBGA, 17×17) packaged for surface-mount assembly, enabling compact board-level integration.
• Power Supply Operates from a core voltage supply range of 1.14 V to 1.575 V to match target system power domains.
• Industrial Temperature Grade Qualified for operation from -40°C to 85°C to meet industrial environmental requirements.
• Regulatory Compliance RoHS compliant for environmental and regulatory alignment in commercial and industrial builds.

Unique Advantages

• Balanced logic and memory mix: Combines 9,216 logic elements with approximately 55 kbits of embedded RAM to support control, glue-logic, and small buffering functions without external memory.
• High I/O density: 178 I/Os provide flexibility to connect multiple peripherals and sensors while minimizing the need for additional interface ICs.
• Compact surface-mount footprint: 256-LBGA (256-FPBGA, 17×17) packaging enables a small PCB area while maintaining robust pin count for system integration.
• Industrial temperature operation: Rated from -40°C to 85°C, suitable for a broad range of industrial environments and deployment scenarios.
• Low-voltage core support: Core voltage range of 1.14 V to 1.575 V allows integration into modern, low-voltage power architectures.
• RoHS compliant: Meets lead-free and restricted substances requirements for regulated markets.

Why Choose AGL400V2-FGG256I?

The AGL400V2-FGG256I positions itself as a compact, industrial-grade FPGA option with a practical combination of logic density, embedded memory, and I/O count. Its 256-LBGA surface-mount package and 178 I/Os facilitate dense board-level designs where space and connection density matter.

This device is well suited for designers seeking a programmable logic element with verified industrial temperature range and RoHS compliance, providing predictable on-chip resources (logic, RAM, I/O) and straightforward power requirements for long-term production designs.

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