AGL400V2-FGG256
| Part Description |
IGLOO Field Programmable Gate Array (FPGA) IC 178 55296 9216 256-LBGA |
|---|---|
| Quantity | 1,136 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 178 | Voltage | 1.14 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 9216 | Number of Logic Elements/Cells | 9216 | ||
| Number of Gates | 400000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 55296 |
Overview of AGL400V2-FGG256 – IGLOO Field Programmable Gate Array, 256-LBGA
The AGL400V2-FGG256 is a Microchip IGLOO family flash FPGA offered in a 256‑pin LBGA package. It provides a mid-density, low-power FPGA fabric with 9,216 logic elements, approximately 55 kbits of embedded RAM, and approximately 400,000 system gates for control, glue-logic, and I/O-centric designs.
Designed for commercial applications, the device emphasizes low-power operation and reprogrammable nonvolatile storage, making it suitable for compact, power-conscious embedded systems that require instant-on behavior and flexible in-system programming.
Key Features
- Logic Capacity — 9,216 logic elements (logic cells) and approximately 400,000 system gates provide mid-range logic resources for control and processing tasks.
- Embedded Memory — Approximately 55 kbits of total on-chip RAM to support buffering, small data tables, and state storage.
- I/O Density — 178 user I/Os to support multiple peripherals, interfaces, and board-level interconnects.
- Low Power Technology — IGLOO family Flash*Freeze technology enables ultra-low power retention modes (as little as 5 μW) and Low Power Active operation (from 12 μW), simplifying system power management.
- Nonvolatile Flash — Reprogrammable flash-based configuration that retains the programmed design when powered off and supports instant-on operation.
- Voltage and Temperature — Core/I/O supply support from 1.14 V to 1.575 V and a commercial operating temperature range of 0 °C to 70 °C.
- Package and Mounting — 256-LBGA (supplier package 256-FPBGA, 17×17) in a surface-mount form factor for compact board designs.
- Security and In-System Programming — IGLOO family supports in-system programming and security features such as on-chip AES decryption and FlashLock (as documented for the IGLOO series).
- Clock Conditioning — Family-level clock conditioning circuitry with CCC blocks and integrated PLL capabilities to support configurable clocking strategies.
- Compliance — RoHS compliant and specified as commercial grade.
Typical Applications
- Low-Power Embedded Control — Ideal for battery-powered and always-on devices that require logic processing while minimizing standby power through Flash*Freeze and Low Power Active modes.
- Interface and Glue Logic — Use as a compact glue-logic solution for bridging peripherals, aggregating I/Os, and implementing custom interface protocols with 178 available I/Os.
- Instant-On Systems — Systems that benefit from nonvolatile reprogrammable configuration and instant-on behavior, where retaining configuration without power is required.
- Secure In-System Updates — Applications requiring in-system programming with AES-based decryption and FlashLock-style content protection provided by the IGLOO family features.
Unique Advantages
- Low Standby Power: Flash*Freeze mode can reduce retention power to as little as 5 μW, enabling aggressive system-level power savings.
- Reprogrammable Nonvolatile Storage: Flash-based configuration retains programmed logic when power is removed, simplifying system bring-up and reducing external configuration memory needs.
- Mid-Density Integration: 9,216 logic elements and approximately 55 kbits of RAM provide a compact balance of logic and memory for embedded control and interface tasks.
- High I/O Count in Small Package: 178 user I/Os in a 256-LBGA package support dense connectivity while maintaining a small board footprint.
- Commercial Temperature and Surface-Mount Packaging: Specified for 0 °C to 70 °C and supplied in a surface-mount 256-FPBGA (17×17) package for mainstream consumer and industrial electronics.
- Series-Level Clocking and Security: IGLOO family features include clock conditioning circuitry with PLL options and on-chip security mechanisms to support disciplined timing and protected updates.
Why Choose AGL400V2-FGG256?
The AGL400V2-FGG256 positions itself as a compact, low-power FPGA option for designers needing mid-range logic capacity, substantial I/O, and nonvolatile reprogrammability. Its IGLOO-family low-power capabilities and flash configuration make it well suited for applications where instant-on behavior, secure in-system updates, and minimized standby power are important.
This device is targeted at engineers building embedded control, interface aggregation, and low-power products who require a balance of integration, configurable logic resources, and RoHS-compliant commercial-grade reliability supported by the IGLOO datasheeted feature set.
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