AGL400V2-FGG144

IC FPGA 97 I/O 144FBGA
Part Description

IGLOO Field Programmable Gate Array (FPGA) IC 97 55296 9216 144-LBGA

Quantity 1,766 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package144-FPBGA (13x13)GradeCommercialOperating Temperature0°C – 70°C
Package / Case144-LBGANumber of I/O97Voltage1.14 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs9216Number of Logic Elements/Cells9216
Number of Gates400000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits55296

Overview of AGL400V2-FGG144 – IGLOO Low Power Flash FPGA, 97 I/Os, 9,216 Logic Elements, 144‑LBGA

The AGL400V2-FGG144 is an IGLOO low power flash Field Programmable Gate Array (FPGA) from Microchip Technology. It combines reprogrammable flash nonvolatile configuration with a mid-density FPGA fabric—providing 9,216 logic elements and approximately 400,000 system gates—for flexible hardware acceleration and control logic in commercial designs.

Designed for low-power and mixed-voltage systems, the device supports flash-based in-system programmability, low-power Flash*Freeze operation, and a broad supply range for I/O voltage compatibility. The 144‑LBGA (144‑FPBGA 13×13) surface-mount package and 97 user I/Os make it suitable for compact, board-level FPGA deployments.

Key Features

  • Logic Capacity — 9,216 logic elements (VersaTile equivalents) and about 400,000 system gates to implement medium-complexity logic, state machines, and datapath acceleration.
  • Embedded Memory — Total on-chip RAM of 55,296 bits for FIFOs, buffering, and small embedded-data storage needs.
  • Low-Power Operation — Flash*Freeze technology for ultra-low-power retention; typical Flash*Freeze mode for the AGL400 class is 32 μW, enabling low standby currents while preserving FPGA content.
  • Reprogrammable Flash Configuration — Flash-based nonvolatile configuration that retains programmed designs when power is removed and supports in-system programming and secure configuration.
  • I/O and Voltage Flexibility — 97 user I/Os with support for mixed-voltage operation and I/O supply range per device of 1.14 V to 1.575 V, enabling integration with a variety of peripheral voltage domains.
  • Package and Mounting — 144‑LBGA (supplier package: 144‑FPBGA, 13×13) surface-mount package suitable for compact board layouts.
  • Commercial Grade — Rated for commercial temperature range (0 °C to 70 °C) and specified supply window consistent with commercial applications.
  • Standards and Compliance — RoHS‑compliant manufacturing status.

Typical Applications

  • Portable and Battery-Powered Devices — Low-power Flash*Freeze retention and flash-based configuration make the device suitable for power-sensitive control and interface logic in portable equipment.
  • Mixed-Voltage Interface Control — 97 user I/Os and wide I/O supply support allow bridging and interfacing between different voltage domains on modern boards.
  • Embedded Control and Peripheral Management — Suitable for implementing sensor interfaces, protocol bridging, user interfaces, and glue logic where moderate logic density and on-chip RAM are required.
  • In-System Programmable Designs — Flash-based ISP capability supports field updates and secure configuration workflows where retaining programmed content across power cycles is important.

Unique Advantages

  • Nonvolatile, Reprogrammable Configuration: Flash-based configuration preserves designs without external configuration memory, simplifying BOM and enabling instant-on behavior.
  • Low Standby Power: Flash*Freeze mode (typical 32 μW for AGL400-class devices) reduces standby energy consumption while maintaining configuration state.
  • Balanced Capacity and I/O Count: 9,216 logic elements paired with 97 user I/Os provide a practical balance for mid-range logic and interfacing tasks without overprovisioning.
  • Flexible Voltage Support: I/O supply range of 1.14 V to 1.575 V and mixed-voltage I/O capability enable integration with diverse system power rails.
  • Compact Surface-Mount Package: 144‑LBGA (144‑FPBGA, 13×13) provides a compact footprint for space-constrained board designs.
  • Commercial Temperature Rating: Specified 0 °C to 70 °C operation aligns with a wide range of consumer and commercial product requirements.

Why Choose AGL400V2-FGG144?

The AGL400V2-FGG144 offers a mid-density IGLOO FPGA option that combines reprogrammable flash configuration, low-power retention modes, and a practical mix of logic capacity and I/O. It is well suited to commercial designs that require moderate logic resources, flexible I/O voltage support, and nonvolatile configuration without external memory.

Backed by the IGLOO family architecture from Microchip Technology, this device provides a stable platform for designs that prioritize low power, in-field programmability, and compact package integration—delivering a clear upgrade path within the IGLOO product line for projects that may scale in logic or I/O requirements.

Request a quote or submit an inquiry to get pricing, availability, and lead-time information for the AGL400V2-FGG144.

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