AGL400V2-CSG196I

The AGL400V2-CSG196I is an IGLOO Field Programmable Gate Array (FPGA) IC from Microchip Technology, packaged in a 196-TFBGA/CSBGA footprint. It provides a balance of programmable logic, embedded memory and I/O capacity for industrial embedded applications.

With 9,216 logic elements, 55,296 bits of on-chip RAM and up to 143 I/Os, this device supports mid-density FPGA designs that require a compact BGA package, industrial temperature operation and low-voltage supply compatibility.

Key Features

• Core Logic 9,216 logic elements (LEs) for implementing combinational and sequential logic functions.
• Embedded Memory 55,296 bits of total on-chip RAM to support local buffering, state storage and small data tables.
• I/O Capacity Up to 143 I/O pins enable flexible interfacing to sensors, peripherals and external logic.
• Gate Count Approximately 400,000 gates to quantify overall device complexity and integration potential.
• Power Supply Range Operates from 1.14 V to 1.575 V, allowing compatibility with low-voltage system domains.
• Package & Mounting 196-TFBGA, CSBGA package (supplier device package: 196-CSP 8×8) with surface-mount mounting for compact board integration.
• Industrial Temperature Grade Rated for operation from −40 °C to 85 °C for use in industrial environments.
• Regulatory Compliance RoHS compliant, indicating adherence to common environmental material restrictions.

Typical Applications

• Industrial Control & Automation — Leverage the industrial temperature range and 9,216 logic elements to implement control logic, protocol handling and I/O aggregation in automation equipment.
• Embedded Signal Processing — Use the on-chip RAM and programmable logic to perform buffering, finite-state control and modest signal-processing tasks in compact systems.
• Communication Interfaces — Deploy the 143 I/Os to implement parallel or serial interface logic and glue functions between system components.

Unique Advantages

• Balanced Integration: Combines 9,216 logic elements with 55,296 bits of RAM and 143 I/Os to reduce the need for external glue logic.
• Compact BGA Footprint: 196-TFBGA/196-CSP (8×8) packaging enables dense board layouts and streamlined PCB area usage.
• Industrial Ready: −40 °C to 85 °C operating range supports deployment in industrial environments where extended temperature performance is required.
• Low-Voltage Operation: Support for 1.14 V to 1.575 V supply rails makes the device suitable for modern low-voltage domains.
• Vendor-Backed Documentation: Manufactured by Microchip Technology with product datasheet documentation available to guide design and integration.

Why Choose AGL400V2-CSG196I?

The AGL400V2-CSG196I positions itself as a mid-density IGLOO FPGA that delivers a practical mix of logic, memory and I/O in a compact BGA package for industrial applications. Its specification set—9,216 logic elements, 55,296 bits of RAM, 143 I/Os, and a −40 °C to 85 °C rating—addresses embedded designs that require reliable operation across temperature and low-voltage system compatibility.

This device is suited to engineers and designers building industrial control, embedded interfacing and compact communication logic where board space, predictable operating range and a clear set of resources are primary considerations. Backed by Microchip Technology product documentation, it offers a straightforward FPGA option for deployment and integration into production designs.

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