AGL400V2-FG256

IC FPGA 178 I/O 256FBGA
Part Description

IGLOO Field Programmable Gate Array (FPGA) IC 178 55296 9216 256-LBGA

Quantity 1,148 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 70°C
Package / Case256-LBGANumber of I/O178Voltage1.14 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs9216Number of Logic Elements/Cells9216
Number of Gates400000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits55296

Overview of AGL400V2-FG256 – IGLOO Field Programmable Gate Array (FPGA) IC 178 55296 9216 256-LBGA

The AGL400V2-FG256 is an IGLOO family flash FPGA in a compact 256-LBGA package designed for low-power, reprogrammable embedded logic. Built for single-chip, small-footprint applications, it brings 9,216 logic elements, approximately 55 kbits of on-chip RAM and 178 I/O to systems that require configurable digital logic with stringent power and board-space constraints.

Its combination of Flash-based nonvolatile configuration, low-voltage core operation and extensive I/O support makes it appropriate for power-sensitive system control, instant-on logic functions and mixed-voltage interfacing in commercial-grade designs.

Key Features

  • Logic Capacity — 9,216 logic elements (cells) and approximately 400,000 system gates for implementing medium-density programmable logic and control functions.
  • On‑Chip Memory — 55,296 total RAM bits (approximately 55 kbits) for embedded data buffering and small memory structures.
  • I/O Resources — 178 user I/Os with bank-selectable voltages to support mixed-voltage system interfaces and flexible board-level integration.
  • Low-Voltage Core — Core voltage supply range from 1.14 V to 1.575 V to support low-power system architectures and single-voltage operation.
  • Flash-Based Nonvolatile Configuration — Reprogrammable flash technology provides instant-on behavior and retains programmed design when powered off.
  • Ultra-Low Power Modes — Series Flash*Freeze and low-power active capabilities enable micro- to sub-milliwatt standby operation as described in the IGLOO family documentation, helping reduce system energy use.
  • Clocking and PLL — Integrated clock conditioning blocks with PLL support in the IGLOO family for clock multiplication, division and phase adjustments (series feature).
  • Package & Mounting — Surface-mount 256-LBGA (supplier package: 256-FPBGA, 17×17) for high-density board layouts and reliable solder mounting.
  • Commercial Temperature Grade — Rated for operation from 0 °C to 70 °C for standard commercial applications.
  • RoHS Compliant — Meets RoHS environmental compliance requirements.

Typical Applications

  • Power-Sensitive Embedded Control — Implement system power management and low-power monitoring logic using the device’s Flash*Freeze and low-power active capabilities.
  • Instant-On Logic — Use as reconfigurable glue logic or control state machines that must retain configuration and enable immediate operation after power-up.
  • Mixed-Voltage Interface Conversion — Bridge multiple I/O voltage domains and handle protocol adaptation where board-level mixed-voltage interfacing is required.
  • Compact, Single‑Chip Solutions — Replace multiple discrete components with a small-footprint FPGA for space-constrained commercial systems requiring reprogrammability.

Unique Advantages

  • Low-power flash architecture: Flash-based nonvolatile configuration enables instant-on operation and low standby power, simplifying power sequencing and system wake-up strategies.
  • Balanced capacity and I/O: 9,216 logic elements paired with 178 I/Os deliver a practical mix of logic and connectivity for medium-density designs without large package overhead.
  • Flexible voltage support: Core operation across 1.14 V–1.575 V and bank-selectable I/O voltages allow easy integration into modern low-voltage systems.
  • Compact LBGA package: The 256-LBGA (17×17) footprint supports high board-density implementations and surface-mount assembly.
  • Commercial-grade reliability: Rated for 0 °C–70 °C operation and RoHS compliant, suitable for mainstream commercial product deployments.

Why Choose AGL400V2-FG256?

The AGL400V2-FG256 delivers a practical, low-power FPGA option for designers who need nonvolatile, reprogrammable logic in a compact package. With 9,216 logic elements, roughly 55 kbits of embedded RAM, and 178 I/Os, it is positioned for medium-density control, interface and power-management tasks in commercial systems.

Its flash configuration, low-voltage core range, and LBGA packaging make it attractive where board space, power consumption and instant-on capability matter. The device is well suited to teams seeking a single-chip programmable solution with straightforward integration into mixed-voltage commercial designs.

Request a quote or submit an inquiry to receive pricing and availability information for the AGL400V2-FG256 tailored to your design and volume requirements.

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