AGL400V2-CS196

The AGL400V2-CS196 is an IGLOO Field Programmable Gate Array (FPGA) IC from Microchip Technology, delivering 9,216 logic elements and approximately 55,296 bits of on-chip RAM in a compact surface-mount package. It targets commercial-temperature embedded designs that require a balance of logic density, I/O capacity and low-voltage operation.

With 143 user I/Os, a 1.14 V to 1.575 V supply range and a 196-TFBGA package, this device is suited to applications needing flexible programmable logic in space-constrained, commercial-grade systems.

Key Features

• Core Logic  Contains 9,216 logic elements (cells) and is specified at 400,000 gates to implement moderate-complexity digital logic and control functions.
• On-Chip Memory  Approximately 55,296 bits of embedded RAM for buffering, FIFOs and small tables directly within the FPGA fabric.
• I/O Capacity  143 user I/Os provide extensive external interfacing options for parallel sensors, control signals and peripheral connectivity.
• Power Supply  Operates from a 1.14 V to 1.575 V supply range to match low-voltage system domains.
• Package & Mounting  196-TFBGA CSBGA package (supplier package: 196-CSP (8×8)) in a surface-mount format for compact board integration.
• Operating Range  Commercial temperature grade with an operating range of 0°C to 70°C for standard commercial-environment applications.
• Environmental Compliance  RoHS compliant for lead-free manufacturing and regulatory compliance in applicable regions.

Typical Applications

• Embedded control and glue logic  Use the FPGA’s 9,216 logic elements to consolidate discrete logic, protocol adaptation and custom control functions on a single device.
• Peripheral and sensor interfacing  143 I/Os allow direct connection to multiple sensors, actuators and peripheral devices for aggregation and preprocessing.
• Data buffering and small memory tasks  On-chip RAM supports small FIFOs, buffering and lookup tables to reduce external memory requirements.
• Compact, low-voltage systems  The 196-TFBGA surface-mount package and 1.14 V–1.575 V supply range suit space- and power-constrained commercial designs.

Unique Advantages

• Balanced logic density: 9,216 logic elements and 400,000 gates provide headroom for moderate-complexity functions without oversizing the bill of materials.
• Generous I/O count: 143 user I/Os simplify board design by enabling multiple direct interfaces to sensors, controls and peripherals.
• On-chip memory: Approximately 55,296 bits of embedded RAM reduce the need for small external memory components for buffering and state storage.
• Compact package: 196-TFBGA (surface mount) and a 196-CSP (8×8) supplier package option support dense PCB layouts and compact system footprints.
• Commercial temperature support: Rated for 0°C to 70°C operation to meet standard commercial-environment product requirements.
• RoHS compliant: Enables use in assemblies requiring lead-free components and assists in regulatory compliance.

Why Choose AGL400V2-CS196?

The AGL400V2-CS196 delivers a balanced combination of logic resources, on-chip memory and a high I/O count in a compact surface-mount package, making it a practical choice for designers implementing moderate-complexity programmable logic in commercial-temperature products. Its low-voltage supply range and RoHS compliance further align it with modern, space- and cost-conscious embedded designs.

This part is suited for engineering teams seeking a Microchip Technology IGLOO FPGA that provides predictable logic capacity, ample I/O and on-chip RAM for consolidating glue logic, interface handling and localized data buffering while keeping board space and component count under control.

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