AGL400V2-CS196I

The AGL400V2-CS196I is an IGLOO Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers a mid-range logic capacity in a compact BGA package, combining programmable logic, on-chip RAM, and a substantial I/O count for embedded and industrial applications.

With 9,216 logic elements, approximately 55,296 bits of embedded memory, and support for 143 I/Os, this device targets designs that require moderate logic density, flexible interfacing, and operation across an industrial temperature range.

Key Features

• Core Logic  9,216 logic elements (cells) providing a logic capacity of approximately 400,000 gates for implementing custom digital functions.
• Embedded Memory  Approximately 0.055 Mbits of on-chip RAM (55,296 bits) for small buffers, FIFOs, or distributed storage.
• I/O Density  143 user I/Os to support multiple peripheral interfaces, bus bridging, and board-level glue logic.
• Power Supply  Operates from a core voltage range of 1.14 V to 1.575 V to match system power domains and enable low-voltage designs.
• Package & Mounting  Available in a 196-TFBGA CSBGA package (supplier package 196-CSP, 8×8) and designed for surface-mount assembly.
• Industrial Temperature Range  Rated for operation from −40 °C to 85 °C, suitable for industrial environments.
• Regulatory Compliance  RoHS compliant for lead-free assembly and regulatory compatibility.

Typical Applications

• Industrial Control & Automation  Use the industrial temperature rating and broad I/O count for implementing motor control interfaces, PLC glue logic, and field communication endpoints.
• Embedded System Glue Logic  Deploy as a bridge or custom logic engine where 143 I/Os and 9,216 logic elements enable protocol adaptation and peripheral aggregation.
• Prototyping and Custom IP Integration  Suitable for integrating moderate-size custom IP blocks and verification of logic before scaling to higher-density devices.

Unique Advantages

• Balanced Logic Capacity: 9,216 logic elements and roughly 400,000 gates deliver a middle-ground option between small CPLDs and larger FPGAs for cost-effective designs.
• Ample I/O for Versatile Interfacing: 143 I/Os enable multiple parallel interfaces, sensor connectivity, and board-level signal routing without external multiplexers.
• Compact BGA Footprint: The 196-TFBGA (196-CSP 8×8) package provides a small board area for space-constrained applications while supporting surface-mount assembly.
• Industrial Temperature Support: Rated −40 °C to 85 °C for deployment in industrial-grade equipment and environments.
• Low-Voltage Operation: Core supply range of 1.14 V to 1.575 V allows integration with modern low-voltage power architectures.
• RoHS Compliant: Conforms to RoHS requirements for lead-free manufacturing processes.

Why Choose AGL400V2-CS196I?

The AGL400V2-CS196I provides a practical combination of logic density, embedded memory, and a high I/O count in a compact BGA package, suited to designers needing a controllable balance of resources and board space. Its industrial temperature rating and RoHS compliance make it appropriate for long-life embedded and industrial applications.

From Microchip Technology, this IGLOO FPGA targets engineers and procurement teams who require a mid-range programmable logic device with defined electrical, thermal, and packaging characteristics for reliable system integration.

Request a quote or submit a purchase inquiry to receive pricing and availability for the AGL400V2-CS196I. Our team can assist with volume pricing and lead-time information to support your design and production schedule.