AGL400V2-FG256I
| Part Description |
IGLOO Field Programmable Gate Array (FPGA) IC 178 55296 9216 256-LBGA |
|---|---|
| Quantity | 502 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 178 | Voltage | 1.14 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 9216 | Number of Logic Elements/Cells | 9216 | ||
| Number of Gates | 400000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 55296 |
Overview of AGL400V2-FG256I – IGLOO Field Programmable Gate Array (FPGA), 256-LBGA
The AGL400V2-FG256I is an IGLOO Field Programmable Gate Array (FPGA) IC from Microchip Technology packaged in a 256-LBGA. It provides 9,216 logic elements and 55,296 bits of on-chip RAM in a surface-mount footprint suited for industrial environments.
With 178 user I/Os, a supply voltage range of 1.14 V to 1.575 V, and an operating temperature range of -40 °C to 85 °C, this device targets industrial designs that require a compact, reprogrammable logic fabric with mid-range capacity and defined environmental capability.
Key Features
- Core Logic 9,216 logic elements (9216) and approximately 400,000 usable gates provide programmable logic capacity for custom digital functions.
- Embedded Memory 55,296 bits of on-chip RAM for buffering, small lookup tables, and modest data storage needs.
- Input/Output 178 I/O pins deliver broad external interfacing capability for sensors, buses, and peripheral control.
- Power Supported supply voltage range from 1.14 V to 1.575 V to match system power domains.
- Package & Mounting 256-LBGA package (supplier device package: 256-FPBGA, 17×17) in a surface-mount form factor for compact board integration.
- Industrial Grade & Temperature Industrial-grade device rated for an operating temperature range of -40 °C to 85 °C.
- Standards Compliance RoHS-compliant construction to meet common environmental and manufacturing requirements.
Unique Advantages
- Balanced logic and memory capacity: 9,216 logic elements alongside 55,296 bits of embedded RAM enable a mix of control logic, state machines, and small buffers without external memory.
- High I/O count in a compact package: 178 I/Os in a 256-LBGA allow dense interfacing while keeping PCB area low with surface-mount assembly.
- Industrial temperature support: Rated -40 °C to 85 °C for deployment in industrial environments where extended temperature operation is required.
- Low-voltage system compatibility: Operates from 1.14 V to 1.575 V to align with modern low-voltage power domains.
- RoHS compliance: Environmentally compliant manufacturing reduces material-restriction risk for assembly and distribution.
Why Choose AGL400V2-FG256I?
The AGL400V2-FG256I positions itself as a mid-density IGLOO FPGA suited to industrial applications requiring a mix of programmable logic, moderate embedded RAM, and a high count of I/O in a compact 256-LBGA package. Its specified supply voltage range and industrial operating temperature make it appropriate for systems that must operate reliably across a broad set of conditions.
Engineers and procurement teams seeking a Microchip Technology FPGA with clear, verifiable specifications for logic elements, on-chip RAM, I/O capacity, package type, and environmental rating will find the AGL400V2-FG256I offers a straightforward option for designs that demand reprogrammable logic without large-area packages or external memory dependencies.
Request a quote or submit an inquiry to receive pricing, availability, and ordering information for the AGL400V2-FG256I.

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