AGL400V5-FG256

The AGL400V5-FG256 is an IGLOO field programmable gate array (FPGA) offered in a compact 256-LBGA package. It provides 9,216 logic elements, approximately 55.3kbits of on-chip RAM, and 178 general-purpose I/O pins, making it suitable for a range of commercial embedded logic tasks.

This surface-mount FPGA operates from a 1.425 V to 1.575 V supply and is specified for commercial temperature operation from 0 °C to 70 °C. It is RoHS compliant and supplied in a 256-FPBGA (17×17) package footprint.

Key Features

• Core Logic 9,216 logic elements (LEs) and approximately 400,000 equivalent gates provide moderate logic density for glue logic, protocol bridges, and embedded controllers.
• Embedded Memory Total on-chip RAM of 55,296 bits (approximately 0.055 Mbits) for small data buffers, FIFOs, and state storage.
• I/O Capacity 178 I/O pins support a wide range of external interfaces and parallel connections to peripherals and sensors.
• Power Single supply operation with a voltage range of 1.425 V to 1.575 V for core power management and board-level design consistency.
• Package & Mounting 256-LBGA package (supplier device package: 256-FPBGA 17×17) in a surface-mount form factor for compact PCB layouts and automated assembly.
• Thermal & Grade Commercial grade device rated for 0 °C to 70 °C operating temperature.
• Environmental Compliance RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Commercial Embedded Systems — Implement application-specific control logic, protocol handling, or data-path processing in compact commercial products.
• Consumer Electronics — Provide glue logic, peripheral interfacing, and custom I/O handling in consumer device designs.
• Communications Equipment — Implement parallel interfaces, protocol bridges, and data buffering where moderate logic density and many I/Os are required.
• Instrumentation and Test Equipment — Handle custom logic, timing control, and I/O routing in bench and rack-mounted instruments.

Unique Advantages

• Balanced Logic Density: 9,216 logic elements provide sufficient resources for mid-range programmable logic tasks without excessive board area.
• Compact Package: 256-LBGA (17×17 FPBGA) delivers a small footprint for space-constrained designs while retaining high I/O count.
• Generous I/O Count: 178 I/Os enable direct connections to multiple peripherals, sensors, and parallel busses.
• On-Chip Memory: Approximately 0.055 Mbits of embedded RAM for local buffering and state storage, reducing external memory needs.
• Commercial Temperature and RoHS Compliance: Specified for 0 °C to 70 °C operation and RoHS compliant to meet common manufacturing and deployment requirements.

Why Choose AGL400V5-FG256?

The AGL400V5-FG256 positions itself as a compact, mid-density FPGA option for commercial designs that require a balance of logic resources, on-chip memory, and a high I/O count. Its 256-LBGA package and surface-mount mounting make it suitable for space-conscious PCBs while providing flexibility for a variety of embedded logic tasks.

This device is well suited to teams and projects needing moderate programmable logic capacity, concentrated I/O connectivity, and RoHS-compliant hardware within a commercial temperature range.

Request a quote or submit a procurement inquiry today to receive pricing and availability for the AGL400V5-FG256.