AGL600V2-CS281

The AGL600V2-CS281 is an IGLOO field programmable gate array (FPGA) offered in a compact 281-TFBGA (CSBGA) package. It provides a mid-density programmable logic fabric with on-chip memory and a substantial I/O count for implementing custom digital functions in commercial applications.

Designed for low-voltage operation and surface-mount assembly, this device is suitable for designs that require configurable logic, moderate embedded memory, and flexible interfacing in a small package footprint.

Key Features

• Core Logic  Approximately 13,824 logic elements (13824 logic elements) and a gate count of 600,000 enable implementation of mid-density logic designs and custom state machines.
• Embedded Memory  Approximately 0.11 Mbits of on-chip RAM (110,592 total RAM bits) for buffering, lookup tables, and small data structures.
• I/O Capacity  Up to 215 general-purpose I/O pins support a wide range of parallel and serial interface connectivity directly from the FPGA.
• Power  Operates from a low-voltage supply range of 1.14 V to 1.575 V to support power-sensitive designs.
• Package & Mounting  281-TFBGA (supplier device package: 281-CSP, 10×10) in a surface-mount form factor for compact board layouts.
• Operating Range & Grade  Commercial grade device rated for operation from 0 °C to 70 °C, suitable for standard-temperature commercial electronics.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Digital Glue Logic and Protocol Bridging  Use the FPGA’s 215 I/O and mid-density logic to implement custom interfacing and protocol conversion between subsystems.
• Embedded Control  Deploy the programmable fabric and on-chip RAM for control state machines, simple motor or power control tasks, and peripheral orchestration in commercial products.
• Signal Aggregation and Preprocessing  Leverage combined logic and embedded RAM for data buffering and preprocessing ahead of system-level processors or converters.
• Compact, Low-Voltage Designs  The small 281-CSP package and 1.14–1.575 V supply range make the device suitable for space-constrained boards and low-voltage system domains.

Unique Advantages

• High logic density in a compact package: 13,824 logic elements and 600,000 gates provide substantial programmable capacity while maintaining a small 281-TFBGA footprint.
• Generous I/O availability: 215 I/O pins enable direct connectivity to multiple peripherals and interfaces without extensive external glue logic.
• On-chip memory for buffering: Approximately 0.11 Mbits of embedded RAM supports local data storage for FIFOs, LUTs, and small data structures.
• Low-voltage operation: The 1.14 V to 1.575 V supply range supports designs targeting reduced power domains.
• Surface-mount, production-ready package: The 281-CSP (10×10) package facilitates automated assembly and compact PCB layouts.
• Regulatory alignment: RoHS compliance helps meet environmental requirements for commercial products.

Why Choose AGL600V2-CS281?

The AGL600V2-CS281 delivers a balanced combination of logic density, embedded memory, and a high I/O count in a compact surface-mount package. Its low-voltage operation and RoHS compliance make it well suited for commercial embedded designs that need configurable logic and flexible interfacing without a large board footprint.

This device is appropriate for engineers and procurement teams developing mid-density programmable solutions where on-chip RAM, a broad set of I/Os, and a compact CSP package are priorities for reducing BOM complexity and enabling flexible, reprogrammable hardware functions.

Request a quote or submit an RFQ today to obtain pricing and availability for the AGL600V2-CS281 IGLOO FPGA.