AGL600V2-CSG281

IC FPGA 215 I/O 281CSP
Part Description

IGLOO Field Programmable Gate Array (FPGA) IC 215 110592 13824 281-TFBGA, CSBGA

Quantity 1,157 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package281-CSP (10x10)GradeCommercialOperating Temperature0°C – 70°C
Package / Case281-TFBGA, CSBGANumber of I/O215Voltage1.14 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs13824Number of Logic Elements/Cells13824
Number of Gates600000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits110592

Overview of AGL600V2-CSG281 – IGLOO FPGA, 13,824 logic elements

The AGL600V2-CSG281 is a Microchip Technology IGLOO field programmable gate array (FPGA) supplied in a 281-TFBGA (CSBGA) surface-mount package. Built on IGLOO low-power flash technology, this device combines reprogrammable flash configuration, embedded SRAM, and a broad I/O complement to address compact, low-power embedded designs.

With 13,824 logic elements, approximately 110.6 kbits of on-chip RAM and 215 user I/Os, the AGL600V2-CSG281 targets battery-sensitive and space-constrained applications that require nonvolatile configuration, low active and ultra-low standby power, and mixed-voltage I/O support.

Key Features

  • Logic Capacity  13,824 logic elements (cells) providing the programmable fabric for custom logic and control functions.
  • Embedded Memory  Approximately 110.6 kbits of total on-chip RAM for data buffering, FIFOs, and small-scale memory needs.
  • System Gates  Approximately 600,000 system gates to support complex logic implementations within a compact device footprint.
  • I/O and Mixed-Voltage Support  215 user I/Os with support for multiple I/O voltage domains to interface with a variety of external peripherals and sensors.
  • Low-Power Operation  Flash*Freeze ultra-low-power mode (as little as 5 μW) and Low Power Active/static idle operation from 12 μW, enabling sustained low standby current while retaining configuration and state.
  • On-Chip Nonvolatile Flash  Reprogrammable flash-based configuration provides instant-on behavior and retains programmed design when powered off.
  • Clocking and PLL  Integrated clock conditioning circuitry and PLL capability (series-level feature) for flexible clock management and system timing.
  • Power Supply Range  Core supply support from 1.14 V to 1.575 V enabling use in low-voltage systems.
  • Package and Mounting  281-TFBGA (CSBGA) surface-mount package; supplier device package listed as 281-CSP (10×10) for compact board designs.
  • Commercial Temperature Grade  Operating range 0 °C to 70 °C, suitable for commercial embedded electronics.
  • Environmental Compliance  RoHS-compliant for regulatory compatibility with lead-free manufacturing processes.

Typical Applications

  • Battery-Powered Devices  Low-power Flash*Freeze and static idle modes let the FPGA manage system wake/scan functions while minimizing standby energy draw.
  • Portable Instruments  Compact 281-TFBGA package and mixed-voltage I/Os make the part suitable for space-constrained portable equipment that requires programmability and on-board memory.
  • Embedded Control and Interfaces  13,824 logic elements and 215 I/Os support glue logic, protocol bridging, sensor interfacing, and user interface control in embedded systems.
  • Secure, Instant-On Systems  Flash-based nonvolatile configuration enables instant-on behavior and retention of programmed design across power cycles for secure, always-ready applications.

Unique Advantages

  • Ultra-Low Standby Power:  Flash*Freeze mode consumes as little as 5 μW, enabling long battery life and low standby-energy designs.
  • Nonvolatile, Reprogrammable Configuration:  Flash-based configuration retains the programmed design when powered off and supports in-system reprogramming.
  • Compact, Surface-Mount Package:  281-TFBGA footprint and 281-CSP (10×10) supplier package allow high-density board integration in small form factors.
  • Flexible I/O and Voltage Support:  Mixed-voltage I/O capability and 215 user I/Os simplify interfacing to diverse peripherals without additional level-shifters.
  • Balanced Performance and Integration:  Significant logic and memory resources plus on-chip clock conditioning and PLL capability reduce external component count and simplify system design.
  • Regulatory and Assembly-Friendly:  Surface-mount format and RoHS compliance align with common manufacturing flows and environmental requirements.

Why Choose AGL600V2-CSG281?

The AGL600V2-CSG281 positions itself as a compact, low-power FPGA option for commercial embedded designs that need nonvolatile configuration, moderate logic capacity, and flexible I/O in a small surface-mount package. Its flash-based instant-on capability, combined with very low standby modes, makes it especially well suited to battery-sensitive and always-on control applications.

Designers who need a balance of programmability, embedded RAM, and mixed-voltage interfacing will find the AGL600V2-CSG281 useful for reducing BOM complexity and enabling scalable, reprogrammable system architectures backed by Microchip’s IGLOO family features.

Request a quote or submit a purchase inquiry to get pricing, availability, and lead-time information for the AGL600V2-CSG281.

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