AGL600V2-CSG281
| Part Description |
IGLOO Field Programmable Gate Array (FPGA) IC 215 110592 13824 281-TFBGA, CSBGA |
|---|---|
| Quantity | 1,157 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 281-CSP (10x10) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 281-TFBGA, CSBGA | Number of I/O | 215 | Voltage | 1.14 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 13824 | Number of Logic Elements/Cells | 13824 | ||
| Number of Gates | 600000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 110592 |
Overview of AGL600V2-CSG281 – IGLOO FPGA, 13,824 logic elements
The AGL600V2-CSG281 is a Microchip Technology IGLOO field programmable gate array (FPGA) supplied in a 281-TFBGA (CSBGA) surface-mount package. Built on IGLOO low-power flash technology, this device combines reprogrammable flash configuration, embedded SRAM, and a broad I/O complement to address compact, low-power embedded designs.
With 13,824 logic elements, approximately 110.6 kbits of on-chip RAM and 215 user I/Os, the AGL600V2-CSG281 targets battery-sensitive and space-constrained applications that require nonvolatile configuration, low active and ultra-low standby power, and mixed-voltage I/O support.
Key Features
- Logic Capacity 13,824 logic elements (cells) providing the programmable fabric for custom logic and control functions.
- Embedded Memory Approximately 110.6 kbits of total on-chip RAM for data buffering, FIFOs, and small-scale memory needs.
- System Gates Approximately 600,000 system gates to support complex logic implementations within a compact device footprint.
- I/O and Mixed-Voltage Support 215 user I/Os with support for multiple I/O voltage domains to interface with a variety of external peripherals and sensors.
- Low-Power Operation Flash*Freeze ultra-low-power mode (as little as 5 μW) and Low Power Active/static idle operation from 12 μW, enabling sustained low standby current while retaining configuration and state.
- On-Chip Nonvolatile Flash Reprogrammable flash-based configuration provides instant-on behavior and retains programmed design when powered off.
- Clocking and PLL Integrated clock conditioning circuitry and PLL capability (series-level feature) for flexible clock management and system timing.
- Power Supply Range Core supply support from 1.14 V to 1.575 V enabling use in low-voltage systems.
- Package and Mounting 281-TFBGA (CSBGA) surface-mount package; supplier device package listed as 281-CSP (10×10) for compact board designs.
- Commercial Temperature Grade Operating range 0 °C to 70 °C, suitable for commercial embedded electronics.
- Environmental Compliance RoHS-compliant for regulatory compatibility with lead-free manufacturing processes.
Typical Applications
- Battery-Powered Devices Low-power Flash*Freeze and static idle modes let the FPGA manage system wake/scan functions while minimizing standby energy draw.
- Portable Instruments Compact 281-TFBGA package and mixed-voltage I/Os make the part suitable for space-constrained portable equipment that requires programmability and on-board memory.
- Embedded Control and Interfaces 13,824 logic elements and 215 I/Os support glue logic, protocol bridging, sensor interfacing, and user interface control in embedded systems.
- Secure, Instant-On Systems Flash-based nonvolatile configuration enables instant-on behavior and retention of programmed design across power cycles for secure, always-ready applications.
Unique Advantages
- Ultra-Low Standby Power: Flash*Freeze mode consumes as little as 5 μW, enabling long battery life and low standby-energy designs.
- Nonvolatile, Reprogrammable Configuration: Flash-based configuration retains the programmed design when powered off and supports in-system reprogramming.
- Compact, Surface-Mount Package: 281-TFBGA footprint and 281-CSP (10×10) supplier package allow high-density board integration in small form factors.
- Flexible I/O and Voltage Support: Mixed-voltage I/O capability and 215 user I/Os simplify interfacing to diverse peripherals without additional level-shifters.
- Balanced Performance and Integration: Significant logic and memory resources plus on-chip clock conditioning and PLL capability reduce external component count and simplify system design.
- Regulatory and Assembly-Friendly: Surface-mount format and RoHS compliance align with common manufacturing flows and environmental requirements.
Why Choose AGL600V2-CSG281?
The AGL600V2-CSG281 positions itself as a compact, low-power FPGA option for commercial embedded designs that need nonvolatile configuration, moderate logic capacity, and flexible I/O in a small surface-mount package. Its flash-based instant-on capability, combined with very low standby modes, makes it especially well suited to battery-sensitive and always-on control applications.
Designers who need a balance of programmability, embedded RAM, and mixed-voltage interfacing will find the AGL600V2-CSG281 useful for reducing BOM complexity and enabling scalable, reprogrammable system architectures backed by Microchip’s IGLOO family features.
Request a quote or submit a purchase inquiry to get pricing, availability, and lead-time information for the AGL600V2-CSG281.

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