AGL600V2-FG144I

The AGL600V2-FG144I is an IGLOO Field Programmable Gate Array (FPGA) IC from Microchip Technology. It integrates 13,824 logic elements with approximately 110,592 bits of on-chip RAM and supports up to 97 I/O pins, providing a balanced combination of logic density, embedded memory, and I/O capability in a compact 144-LBGA package.

Designed for industrial-grade environments, the device operates over a supply voltage range of 1.14 V to 1.575 V and an ambient temperature range of -40 °C to 85 °C, making it suitable for designs that require sustained operation across a wide temperature span.

Key Features

• Core Logic  13,824 logic elements (cells) and a gate equivalent of 600,000 provide significant programmable logic capacity for custom digital functions.
• Embedded Memory  Approximately 110,592 bits of on-chip RAM to support buffering, state storage, and small data structures without external memory.
• I/O Density  Up to 97 I/O pins, enabling a variety of external interfaces and signal connections in compact designs.
• Power and Voltage  Supports core supply voltages from 1.14 V to 1.575 V, allowing operation within low-voltage system domains.
• Package and Mounting  144-LBGA (supplier device package: 144-FPBGA 13×13) surface-mount package for space-efficient PCB integration.
• Industrial Temperature Grade  Rated for operation from -40 °C to 85 °C, suitable for industrial temperature environments.
• Environmental Compliance  RoHS compliant for regulatory conformity in applicable regions.

Typical Applications

• Industrial Control  Industrial-grade temperature range and flexible I/O count support control logic and interface functions in factory and process equipment.
• Embedded Systems  The combination of 13,824 logic elements and on-chip RAM enables integration of custom peripherals and glue logic in compact embedded designs.
• Interface and Signal Processing  Up to 97 I/Os and substantial programmable logic density allow implementation of protocol bridging, I/O conditioning, and signal aggregation.

Unique Advantages

• High Logic Integration: 13,824 logic elements and 600,000 gate-equivalents reduce the need for multiple discrete logic devices.
• On-chip Memory Availability: Approximately 110,592 bits of embedded RAM simplify buffering and state retention without external memory chips.
• Low-voltage Operation: Core supply support from 1.14 V to 1.575 V enables integration into low-voltage power domains.
• Industrial Temperature Support: Rated -40 °C to 85 °C for designs that require consistent operation across wide temperature ranges.
• Compact, Surface-Mount Package: 144-LBGA (13×13 FPBGA) packaging provides a space-efficient footprint for PCB-constrained applications.
• Regulatory Compliance: RoHS status compliant for environmentally conscious designs and markets.

Why Choose AGL600V2-FG144I?

The AGL600V2-FG144I positions itself as a versatile, industrial-grade FPGA option that combines substantial programmable logic capacity, on-chip RAM, and a robust I/O count within a compact 144-LBGA package. Its low-voltage core operation and extended temperature rating make it suitable for engineers designing systems that require reliable digital integration under industrial conditions.

This device is well suited for teams seeking to consolidate logic, memory, and interface functions onto a single programmable device—reducing component count and simplifying board-level design while maintaining regulatory compliance and temperature robustness.

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