AGL600V2-FGG144

IC FPGA 97 I/O 144FBGA
Part Description

IGLOO Field Programmable Gate Array (FPGA) IC 97 110592 13824 144-LBGA

Quantity 239 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package144-FPBGA (13x13)GradeCommercialOperating Temperature0°C – 70°C
Package / Case144-LBGANumber of I/O97Voltage1.14 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs13824Number of Logic Elements/Cells13824
Number of Gates600000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits110592

Overview of AGL600V2-FGG144 – IGLOO Field Programmable Gate Array (FPGA) IC, 13824 Logic Elements, 144-LBGA

The AGL600V2-FGG144 is a commercial-grade Field Programmable Gate Array (FPGA) IC from Microchip Technology, offering a balance of logic density, embedded memory, and a compact BGA package for surface-mount assembly. It delivers 13,824 logic elements, approximately 110,592 bits of on-chip RAM, and 97 I/Os to support a variety of mid-density programmable logic functions in commercial electronics.

With a supply voltage range of 1.14 V to 1.575 V and an operating temperature range of 0 °C to 70 °C, this device suits commercial embedded applications that require a moderate gate count and integrated memory in a 144-LBGA footprint.

Key Features

  • Core / Logic  13,824 logic elements and approximately 600,000 equivalent gates provide mid-range logic capacity for custom functions and glue logic.
  • On-chip Memory  Approximately 110,592 bits of embedded RAM for localized data buffering, state storage, and small LUT-based memory needs.
  • I/O Capacity  97 user I/O pins to support a wide range of peripheral interfaces and signal routing on commercial PCBs.
  • Power  Operates from a 1.14 V to 1.575 V supply range, enabling integration into designs with modern core-voltage domains.
  • Package & Mounting  144-LBGA package (supplier device package: 144-FPBGA (13x13)) with surface-mount mounting for compact board layouts and reliable solder joints.
  • Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 70 °C, suitable for mainstream commercial applications.
  • Compliance  RoHS compliant, supporting regulatory requirements for lead-free assemblies.

Typical Applications

  • Commercial Embedded Systems  Implement mid-density custom logic and interface control using 13,824 logic elements and 97 I/Os in consumer and commercial products.
  • Data Buffering & Protocol Handling  Use the on-chip RAM (approximately 110,592 bits) and gate resources for protocol bridging, packet buffering, and state machines.
  • Instrument Control & Test Equipment  Provide flexible I/O and programmable logic to drive custom measurement, timing, and control functions in instrumentation.

Unique Advantages

  • Balanced logic and memory capacity: 13,824 logic elements paired with approximately 110,592 bits of RAM enable both control logic and modest data buffering without external memory.
  • High gate count for mid-density designs: Approximately 600,000 equivalent gates allow implementation of complex finite-state machines and glue logic.
  • Generous I/O: 97 I/O pins simplify interfacing to multiple peripherals and bus systems on compact PCBs.
  • Compact surface-mount BGA: 144-LBGA (144-FPBGA, 13×13) footprint supports space-constrained board designs while providing robust soldered connections.
  • Commercial-grade compliance: Operating range of 0 °C to 70 °C and RoHS compliance make the device suitable for standard commercial product environments.
  • Manufacturer backing: Supplied by Microchip Technology, offering the traceability and supply chain support expected for commercial FPGA deployments.

Why Choose AGL600V2-FGG144?

AGL600V2-FGG144 is positioned for commercial designs that require a mid-range FPGA with a combination of logic, memory, and I/O resources in a compact surface-mount package. Its 13,824 logic elements, approximately 110,592 bits of embedded RAM, and 97 I/Os make it well suited for applications that need programmable logic density without external memory additions.

Designed and manufactured by Microchip Technology and offered in a 144-LBGA surface-mount package, this device provides a reliable, RoHS-compliant option for commercial embedded projects where predictable operating conditions (0 °C to 70 °C) and a defined supply voltage range are required.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for the AGL600V2-FGG144.

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