AGL600V2-FGG256

The AGL600V2-FGG256 is an IGLOO Field Programmable Gate Array (FPGA) from Microchip Technology designed for applications that require moderate logic density and on-chip memory in a compact, surface-mount package. This commercial-grade device provides 13,824 logic elements, 110,592 bits of on-chip RAM and up to 177 I/O pins, enabling integration of custom digital functions with a focused footprint and low-voltage operation.

With a supply voltage range of 1.14 V to 1.575 V and an operating temperature range of 0 °C to 70 °C, the AGL600V2-FGG256 is suited to standard commercial electronic systems where RoHS compliance and compact packaging are priorities.

Key Features

• Logic Capacity — 13,824 logic elements (LEs) provide the core programmable fabric for implementing custom logic, finite state machines, and glue-logic functions.
• On-Chip Memory — 110,592 bits of embedded RAM for distributed storage, buffering, and small data structures directly within the FPGA fabric.
• I/O Resources — Up to 177 I/O pins allow flexible interfacing to external peripherals, sensors, and other system components.
• Gate Count — Approximately 600,000 gates indicating overall implementation capacity for moderate-complexity designs.
• Power and Voltage — Specified supply range of 1.14 V to 1.575 V to match low-voltage system domains.
• Package and Mounting — 256-LBGA (supplier package: 256-FPBGA, 17×17) in a surface-mount form factor for space-constrained PCBs.
• Commercial Grade & RoHS — Commercial temperature grading (0 °C to 70 °C) and RoHS-compliant material status for regulatory alignment.

Unique Advantages

• Balanced logic and memory — 13,824 logic elements paired with 110,592 bits of RAM supports both logic-intensive functions and on-chip data storage without external memory for many designs.
• High I/O count in a compact package — 177 I/Os in a 256-LBGA footprint help reduce PCB area while maintaining connectivity to multiple peripherals.
• Low-voltage integration — 1.14 V to 1.575 V supply range facilitates direct compatibility with low-voltage domains commonly used in modern digital systems.
• Surface-mount convenience — 256-LBGA surface-mount package supports automated assembly and dense board layouts.
• Regulatory and commercial readiness — RoHS compliance and commercial temperature rating make the device suitable for mainstream electronic products and prototypes.

Why Choose AGL600V2-FGG256?

The AGL600V2-FGG256 delivers a mid-range FPGA solution that emphasizes a practical mix of logic density, embedded RAM, and I/O capability in a space-efficient package. Its specifications — including 13,824 logic elements, 110,592 bits of on-chip RAM, 177 I/Os, and a 256-LBGA surface-mount package — make it a suitable option for commercial electronic designs that require integrated programmable logic without extensive board-level complexity.

Manufactured by Microchip Technology and provided as a RoHS-compliant, commercial-grade device, this part is appropriate for designers seeking a scalable, compact FPGA option for prototyping and production in standard-temperature commercial environments. Detailed device information is available from the manufacturer’s technical documentation.

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