AGL600V2-FGG144I
| Part Description |
IGLOO Field Programmable Gate Array (FPGA) IC 97 110592 13824 144-LBGA |
|---|---|
| Quantity | 1,844 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-FPBGA (13x13) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LBGA | Number of I/O | 97 | Voltage | 1.14 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 13824 | Number of Logic Elements/Cells | 13824 | ||
| Number of Gates | 600000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 110592 |
Overview of AGL600V2-FGG144I – IGLOO Field Programmable Gate Array (FPGA) IC, 13,824 logic elements, 110,592‑bit RAM, 97 I/O, 144‑LBGA
The AGL600V2-FGG144I is an IGLOO Field Programmable Gate Array (FPGA) IC from Microchip Technology offering a mid-density logic fabric in a compact 144‑LBGA package. With 13,824 logic elements, 110,592 bits of on‑chip RAM and 97 programmable I/O, this industrial‑grade device is intended for embedded systems that require programmable logic in a small footprint and industrial operating range.
Key Features
- Core Logic 13,824 logic elements providing flexible programmable logic capacity for implementing custom digital functions.
- Gate Count Approximately 600,000 logic gates to support a range of mid-density logic designs.
- On‑Chip Memory 110,592 bits of embedded RAM (≈0.11 Mbits) for buffering, registers, and small data storage tasks.
- I/O 97 general‑purpose I/O pins to interface with external peripherals and system signals.
- Power Supported core voltage range of 1.14 V to 1.575 V to match modern low‑voltage system rails.
- Package & Mounting 144‑lead LBGA (supplier package: 144‑FPBGA, 13×13) in a surface‑mount form factor for compact PCB integration.
- Temperature & Grade Industrial operating temperature range of −40 °C to 85 °C, qualified for use in industrial environments.
- Environmental Compliance RoHS‑compliant to support regulatory and manufacturing requirements.
Unique Advantages
- Mid‑density logic capacity: 13,824 logic elements enable substantial programmable functionality without the size or cost of higher‑density devices.
- Integrated RAM for local data handling: 110,592 bits of on‑chip memory reduce dependency on external memory for control, buffering, and small data structures.
- Compact board footprint: The 144‑LBGA (13×13) package supports dense PCB layouts and surface‑mount assembly.
- Industrial temperature rating: −40 °C to 85 °C operation supports deployment in industrial environments.
- Low‑voltage operation: 1.14 V to 1.575 V supply range allows integration with modern low‑voltage power domains.
- Regulatory readiness: RoHS compliance simplifies adoption into regulated manufacturing processes.
Why Choose AGL600V2-FGG144I?
The AGL600V2-FGG144I delivers a balanced combination of logic capacity, embedded memory, and I/O in a compact industrial‑grade package from Microchip Technology. Its specification set is well suited to applications that need a programmable logic device with mid‑range resources, tight PCB integration, and operation across standard industrial temperatures.
For engineering teams and procurement focused on reliable, RoHS‑compliant FPGAs with clearly defined resource counts and low‑voltage compatibility, the AGL600V2-FGG144I offers a straightforward option that aligns with industrial design requirements and compact form‑factor constraints.
Request a quote or submit an inquiry to our sales team for pricing, lead times, and availability of the AGL600V2-FGG144I.

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