AGL600V2-FG256

The AGL600V2-FG256 is an IGLOO field programmable gate array (FPGA) from Microchip Technology designed for commercial embedded applications. It provides a mid-range programmable logic resource with a defined set of logic elements, on-chip RAM, and I/O to implement custom digital functions.

With 13,824 logic elements, 110,592 bits of total on-chip RAM, 177 I/O pins and an estimated 600,000 gates of logic capacity in a compact 256-LBGA package, this device targets commercial designs that require moderate logic density, on-chip memory and a high I/O count while operating from a 1.14 V to 1.575 V supply and a 0 °C to 70 °C temperature range.

Key Features

• Logic Capacity  Provides 13,824 logic elements for implementing mid-range programmable logic functions and custom digital architectures.
• On-Chip Memory  Includes 110,592 bits of total RAM to support local buffering, state storage and small embedded data structures.
• I/O Resources  177 available I/O pins give flexibility for multi-channel interfacing, bus connections and external device control.
• Logic Scale  Rated at approximately 600,000 gates of logic capacity for complex combinational and sequential designs.
• Power and Voltage  Operates over a supply range of 1.14 V to 1.575 V, allowing integration into low-voltage system rails.
• Package & Mounting  Supplied in a 256-LBGA package (supplier package: 256-FPBGA 17×17) and intended for surface-mount assembly.
• Commercial Grade & Thermal  Commercial-grade device specified for operation from 0 °C to 70 °C.
• Compliance  RoHS-compliant for environmental and manufacturing requirements.

Typical Applications

• Commercial Embedded Systems  Used as the central programmable logic element in commercial embedded designs that require moderate logic density and on-chip RAM.
• Prototyping and Proof-of-Concept  Well suited for board-level prototyping where 13,824 logic elements and abundant I/O enable rapid validation of digital architectures.
• I/O-Intensive Interface Bridging  With 177 I/Os, it can serve as a bridge or glue logic device between multiple peripherals, buses or sensors in commercial products.
• Low-Voltage System Integration  Designed for systems operating within a 1.14 V to 1.575 V supply envelope where on-chip logic and memory are required.

Unique Advantages

• Right-sized Logic Capacity: 13,824 logic elements provide a balance between capability and cost for mid-range programmable designs.
• On-chip Memory for Local Processing: 110,592 bits of RAM enable buffering and small data stores without external memory.
• High I/O Count: 177 I/Os simplify board-level connectivity and reduce the need for external multiplexing.
• Compact, Surface-Mount Package: 256-LBGA (256-FPBGA 17×17) delivers a small footprint for space-constrained PCBs.
• Commercial Temperature and RoHS Compliance: Specified for 0 °C to 70 °C operation and RoHS-compliant for commercial manufacturing requirements.

Why Choose AGL600V2-FG256?

The AGL600V2-FG256 combines moderate logic density, on-chip RAM and a high I/O count in a compact 256-LBGA package, making it a practical choice for commercial embedded designs and prototyping projects that require integrated programmable logic. Its supply voltage range and commercial temperature grading align with many low-voltage, consumer-focused system architectures.

Manufactured by Microchip Technology, this IGLOO FPGA offers a specified set of capabilities—13,824 logic elements, 110,592 bits of RAM, 177 I/Os and approximately 600,000 gates—to help streamline design choices where predictable, on-board programmable logic is needed.

Request a quote or submit a pricing inquiry today to check availability and lead time for the AGL600V2-FG256.