AGL600V2-CSG281I

IC FPGA 215 I/O 281CSP
Part Description

IGLOO Field Programmable Gate Array (FPGA) IC 215 110592 13824 281-TFBGA, CSBGA

Quantity 874 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package281-CSP (10x10)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case281-TFBGA, CSBGANumber of I/O215Voltage1.14 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs13824Number of Logic Elements/Cells13824
Number of Gates600000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits110592

Overview of AGL600V2-CSG281I – IGLOO Field Programmable Gate Array, 215 I/Os, 281-TFBGA

The AGL600V2-CSG281I is an IGLOO flash-based Field Programmable Gate Array (FPGA) in a 281-TFBGA (CSBGA) package designed for industrial applications. Built on the IGLOO low-power flash FPGA architecture, it delivers reprogrammable nonvolatile logic with low standby and active power modes for compact, power-efficient embedded and industrial designs.

Key on-chip resources include 13,824 logic elements, approximately 0.11 Mbits of embedded RAM, and 215 user I/Os, providing a balance of density, I/O capacity, and low-power operation for control, I/O bridging, and system-power-management applications.

Key Features

  • Programmable Logic — 13,824 logic elements (cells) supporting designs up to 600,000 system gates, enabling medium-density FPGA implementations.
  • Embedded Memory — Total on-chip RAM of 110,592 bits (approximately 0.11 Mbits) for user data and buffering.
  • I/O Capacity & Flexibility — 215 user I/Os with bank-selectable voltages and mixed-voltage operation, suitable for interfacing diverse peripherals and signal standards.
  • Low-Power Operation — Flash*Freeze ultra-low-power mode (as low as 5 μW) and Low Power Active capability (from 12 μW) to minimize system standby and enable energy-aware designs.
  • Nonvolatile Flash Technology — Flash-based FPGA fabric that retains programmed design when powered off and supports reprogramming for field updates.
  • Clocking and Timing — Integrated clock conditioning blocks with one block including a PLL; series-level system performance up to 250 MHz (1.5 V systems) and 160 MHz (1.2 V systems).
  • Security & In-System Programming — Supports in-system programming with on-chip 128-bit AES decryption and FlashLock for protecting FPGA content (series feature).
  • Industrial Grade and Packaging — Industrial operating temperature range of −40 °C to 85 °C, supplied in a 281-TFBGA / 281-CSP (10×10) surface-mount package; RoHS compliant.
  • Supply Voltage — Core and related supply support in the range of 1.14 V to 1.575 V for low-voltage system integration.

Typical Applications

  • Industrial Control — Implement motor control logic, deterministic state machines, and sensor aggregation in industrial systems that require industrial temperature range and robust I/O.
  • Low-Power Embedded Systems — Use Flash*Freeze and Low Power Active modes to implement always-on control, wake-from-sensor tasks, and energy-sensitive monitoring functions.
  • I/O Bridging and Protocol Conversion — Leverage 215 user I/Os and mixed-voltage bank support to build interface bridges and protocol translators between legacy and modern subsystems.
  • Secure In-System Programmable Logic — Deploy reprogrammable logic with on-chip AES-based ISP and FlashLock features for field updates with content protection.

Unique Advantages

  • Single-Chip, Nonvolatile Solution: Flash-based fabric retains the programmed design without external configuration memory, simplifying BOM and system startup.
  • Ultra-Low Standby Power: Flash*Freeze mode (as low as 5 μW) and Low Power Active operation enable designs that require minimal standby energy while retaining state.
  • Balanced Resource Set: 13,824 logic elements, ~0.11 Mbits of RAM and 215 I/Os provide a versatile mix of logic, memory, and connectivity for medium-density applications.
  • Industrial Readiness: Rated for −40 °C to 85 °C operating temperature and supplied in a compact 281-TFBGA package suitable for industrial PCBs and surface-mount assembly.
  • Flexible Clocking: Multiple clock conditioning blocks and an integrated PLL support configurable clock management for performance and timing control.
  • Protected Field Updates: Series-level support for 128-bit AES ISP and FlashLock enables secure firmware updates and IP protection in deployed systems.

Why Choose AGL600V2-CSG281I?

The AGL600V2-CSG281I provides a practical combination of low-power operation, nonvolatile reprogrammability, and a balanced set of logic, memory, and I/O resources for industrial and embedded designs. Its flash-based IGLOO architecture supports instant-on behavior and secure in-system programming while reducing the need for external configuration storage.

Choose this device when you need a compact, surface-mount FPGA with industrial temperature capability, efficient standby modes, and the flexibility to support mixed-voltage interfaces and secure field updates—helping simplify system design and long-term maintainability.

Request a quote or submit an inquiry to our sales team to discuss pricing, availability, or sample requests for the AGL600V2-CSG281I.

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