AGLN060V5-VQ100
| Part Description |
IGLOO nano Field Programmable Gate Array (FPGA) IC 71 18432 1536 100-TQFP |
|---|---|
| Quantity | 277 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 100-VQFP (14x14) | Grade | Commercial | Operating Temperature | -20°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-TQFP | Number of I/O | 71 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1536 | Number of Logic Elements/Cells | 1536 | ||
| Number of Gates | 60000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 18432 |
Overview of AGLN060V5-VQ100 – IGLOO nano FPGA (1536 logic elements, 71 I/Os, 100-TQFP)
The AGLN060V5-VQ100 is an IGLOO nano Field Programmable Gate Array (FPGA) from Microchip Technology. It provides 1536 logic elements and 18,432 bits of on-chip RAM in a 100-TQFP package suited for surface-mount assembly.
With 71 I/O pins and a specified supply voltage range of 1.425 V to 1.575 V, this commercial-grade FPGA is sized for compact embedded designs that require moderate logic density, on-chip memory, and flexible I/O connectivity within a standard 14×14 VQFP footprint.
Key Features
- Core Logic 1536 logic elements (LEs) providing programmable logic resources for glue logic, state machines, and custom digital functions.
- Embedded Memory 18,432 bits of on-chip RAM to support small FIFOs, buffers, and configuration storage without external memory.
- I/O Capability 71 user I/Os to interface with sensors, peripherals, and bus-level signals in space-constrained designs.
- Power Supply Narrow operating supply range of 1.425 V to 1.575 V for predictable power-domain design and decoupling.
- Package and Mounting 100-TQFP (supplier device package: 100-VQFP, 14×14 mm) surface-mount package for compact PCB layouts and industry-standard assembly.
- Operating Range Commercial operating temperature from -20 °C to 85 °C to match a wide range of ambient conditions for consumer and industrial electronics.
- Environmental Compliance RoHS compliant to support lead-free manufacturing processes.
Typical Applications
- Interface and Glue Logic Implement protocol converters, bus bridges, and board-level glue logic using the available 1536 logic elements and 71 I/Os.
- User Interface Control Drive button matrices, LEDs, and displays while handling debouncing and state control with on-chip RAM for temporary storage.
- Sensor and Peripheral Aggregation Aggregate and preprocess signals from multiple sensors or peripherals using the FPGA’s I/O count and embedded memory.
- Low- to Mid-density Embedded Systems Integrate custom finite state machines, timing control, and simple signal processing functions within a compact 100-TQFP footprint.
Unique Advantages
- Right-sized Logic Capacity: 1536 logic elements provide a balanced amount of programmable logic for designs that need more than small CPLDs but less than high-density FPGAs.
- On-chip Memory Reduces BOM: 18,432 bits of embedded RAM reduce the need for external memory for small buffering and control state storage.
- Generous I/O Count: 71 I/Os allow direct connectivity to multiple peripherals and interfaces without consuming additional transceivers or expanders.
- Compact, Standard Package: 100-TQFP / 100-VQFP (14×14 mm) packaging supports standard PCB assembly and helps minimize board area.
- Predictable Power Design: A defined supply range (1.425 V to 1.575 V) simplifies power-supply selection and decoupling strategies.
- RoHS Compliant: Meets environmental requirements for lead-free assembly and regulatory compliance in many global markets.
Why Choose AGLN060V5-VQ100?
The AGLN060V5-VQ100 delivers a compact FPGA option that balances programmable logic, embedded memory, and I/O density in a standard 100-TQFP surface-mount package. Its specifications support engineers building compact, cost-sensitive embedded systems that require on-chip buffering and flexible interfacing without a large board footprint.
This device is appropriate for designers seeking a commercially graded FPGA solution backed by Microchip Technology’s product ecosystem, offering predictable electrical characteristics, RoHS compliance, and a footprint compatible with common manufacturing processes.
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