AGLN250V2-ZCSG81I

The AGLN250V2-ZCSG81I is an IGLOO nano field programmable gate array (FPGA) IC designed to deliver compact, reprogrammable digital logic in a small surface-mount package. It provides 6,144 logic elements, approximately 0.037 Mbits of embedded memory, and 60 general-purpose I/O pins, making it suitable for embedded and industrial designs requiring programmable logic density in a low-profile form factor.

With an industrial-grade operating temperature range and a low-voltage core supply window, this device targets applications that need reliable operation across a wide thermal range while minimizing power supply complexity.

Key Features

• Core Logic — 6,144 logic elements (cells) and an estimated 250,000 gates to implement custom digital functions and finite-state logic.
• Embedded Memory — Total on-chip RAM of 36,864 bits (approximately 0.037 Mbits) for small data buffers, FIFOs, and state storage.
• I/O Capacity — 60 I/O pins to interface with peripherals, sensors, and external logic devices in constrained designs.
• Power — Core supply range from 1.14 V to 1.575 V to match low-voltage system domains and enable efficient power delivery.
• Temperature and Grade — Industrial grade operation with an ambient temperature range of −40 °C to 100 °C for deployment in harsher environments.
• Package and Mounting — Available in an 81-WFBGA, CSBGA package; supplier device package listed as 81-CSP (5×5). Surface-mount mounting for PCB integration.
• Regulatory Status — RoHS compliant.

Typical Applications

• Industrial Control — Industrial-grade temperature range and 60 I/O pins support control logic, small-scale automation, and signal conditioning tasks in factory and process environments.
• Embedded System Glue Logic — Use programmable logic elements and on-chip RAM to consolidate discrete peripherals and interface adaptation in compact embedded designs.
• Sensor and I/O Aggregation — 60 I/O lines facilitate grouping, preprocessing, and conditioning of sensor signals before passing data to host processors.

Unique Advantages

• Compact, Programmable Integration: 6,144 logic elements and embedded RAM enable consolidation of multiple discrete components into a single reprogrammable device, reducing BOM and board area.
• Industrial Reliability: Rated for −40 °C to 100 °C operation, suitable for deployments where extended temperature tolerance is required.
• Low-Voltage Core Compatibility: Core supply from 1.14 V to 1.575 V aligns with modern low-voltage system rails, helping simplify power-system design.
• Surface-Mount, Small Footprint: 81-pin WFBGA/CSBGA (81-CSP 5×5) package supports high-density PCB designs while maintaining a small mechanical profile.
• RoHS Compliant: Conforms to RoHS requirements for environmental compliance in manufacturing and application.

Why Choose AGLN250V2-ZCSG81I?

The AGLN250V2-ZCSG81I positions itself as a compact, industrial-grade FPGA option for designers needing mid-range programmable logic, modest embedded memory, and a substantial I/O count in a small surface-mount package. Its combination of 6,144 logic elements, approximately 36,864 bits of on-chip RAM, and a wide operating temperature range makes it well suited to embedded and industrial applications that demand reconfigurability with reliable environmental performance.

This device is appropriate for engineers and procurement teams seeking a programmable, low-voltage FPGA that can reduce component count, enable design flexibility, and support deployment across a broad temperature span with RoHS-compliant manufacturing.

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