AGLP030V2-CSG289

The AGLP030V2-CSG289 is a Microchip Technology IGLOO PLUS flash FPGA in a compact 289‑TFBGA package. It delivers 792 logic elements (versaTiles), approximately 30,000 system gates and 120 user I/Os in a low‑power, surface‑mount form factor for commercial‑grade embedded designs.

Designed for applications that require nonvolatile instant‑on capability and aggressive power management, this device combines flash configuration retention with ultra‑low power Flash*Freeze operation and flexible mixed‑voltage I/O support to simplify single‑chip system designs.

Key Features

• Core Capacity — 792 logic elements (versaTiles) and 30,000 system gates provide discrete logic density for glue logic, protocol bridging, and control functions.
• I/O Resources — 120 user I/Os with bank‑selectable, mixed‑voltage operation to interface with 1.2V, 1.5V, 1.8V, 2.5V and 3.3V domains (family feature set).
• Nonvolatile Configuration — Flash-based configuration stores design data across power cycles, enabling instant‑on behavior and simplified system startup.
• Ultra‑Low Power Modes — Flash*Freeze technology enables micro‑watt class standby (typical 5 μW for the AGLP030 family device), allowing retention of design state while minimizing power draw.
• Memory — Includes 1 kbit of on‑chip FlashROM for user nonvolatile storage; this specific device does not include embedded SRAM or PLL support.
• Power and Temperature — Core supply range 1.14 V to 1.575 V and commercial operating temperature 0 °C to 85 °C for standard embedded applications.
• Package & Mounting — Surface‑mount 289‑TFBGA (supplier package 289‑CSP, 14×14) for compact PCB layouts; RoHS compliant.

Typical Applications

• Battery‑Powered and Portable Devices — Ultra‑low standby power and instant‑on flash configuration reduce system power consumption and improve duty‑cycle responsiveness.
• Power Management and Control — Use as a system controller to manage power states with retained I/O and register states during low‑power modes.
• Interface Bridging and Glue Logic — Dense I/O and mixed‑voltage support make it suitable for protocol translation, bus bridging, and peripheral control.
• Compact Embedded Systems — Small 289‑TFBGA package and single‑chip flash configuration are well suited to space‑constrained boards requiring reprogrammability.

Unique Advantages

• Low Standby Power: Flash*Freeze mode provides micro‑watt retention of design and I/O states, enabling energy‑efficient system standby.
• Nonvolatile Instant‑On: Flash configuration retains the programmed design when powered off, simplifying system bring‑up and eliminating external configuration memory.
• Flexible I/O Voltage Support: Mixed‑voltage bank operation supports multiple interface standards without extra level‑shifting components.
• Compact, Surface‑Mount Package: 289‑TFBGA (289‑CSP, 14×14) provides a small PCB footprint for dense board layouts.
• Commercial Grade Reliability: Specified for 0 °C to 85 °C operation with RoHS compliance for standard embedded product lines.

Why Choose AGLP030V2-CSG289?

The AGLP030V2-CSG289 positions itself as a low‑power, flash‑based FPGA option for designers needing compact, reprogrammable logic with reliable nonvolatile configuration. With 792 logic elements, 120 I/Os, and Flash*Freeze ultra‑low power capability, it is well suited to embedded control, interface logic, and portable systems that prioritize power efficiency and instant‑on behavior.

Choosing this Microchip IGLOO PLUS device delivers a single‑chip solution that retains design state across power cycles, simplifies board-level power management, and reduces external BOM by leveraging onboard flash configuration and dense I/O support.

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