AGLP060V2-VQG176
| Part Description |
IGLOO PLUS Field Programmable Gate Array (FPGA) IC 137 18432 1584 176-TQFP |
|---|---|
| Quantity | 308 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 176-VQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 176-TQFP | Number of I/O | 137 | Voltage | 1.14 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1584 | Number of Logic Elements/Cells | 1584 | ||
| Number of Gates | 60000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 18432 |
Overview of AGLP060V2-VQG176 – IGLOO PLUS Field Programmable Gate Array (FPGA) IC, 176‑TQFP, 137 I/Os
The AGLP060V2-VQG176 is an IGLOO PLUS Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers a compact, mid-density programmable-logic solution in a 176‑lead TQFP package for commercial electronic designs.
With 1,584 logic elements, approximately 18,432 bits of on-chip RAM and 137 user I/Os, this device is intended for applications that require moderate logic capacity, flexible I/O count and low-voltage operation in a surface-mount package.
Key Features
- Core Logic 1,584 logic elements (cells) providing approximately 60,000 equivalent gates for implementing custom digital functions.
- Embedded Memory Approximately 18,432 bits of on-chip RAM to support buffering, small lookup tables and state storage.
- I/O Capacity 137 user I/Os for interfacing to peripherals, sensors and external devices.
- Power Supply Operates from 1.14 V to 1.575 V, supporting low-voltage system rails.
- Package & Mounting 176‑TQFP package; supplier device package listed as 176‑VQFP (20×20). Surface-mount mounting type for compact PCB implementations.
- Operating Range & Grade Commercial grade device rated for 0 °C to 85 °C operation.
- Environmental Compliance RoHS compliant.
Typical Applications
- Custom Logic and Prototyping Implement user-defined digital functions and state machines using the device's 1,584 logic elements and on-chip RAM.
- I/O Expansion and Interface Bridging Use the 137 I/Os to bridge buses, aggregate sensor inputs or extend MCU/processor interfaces in compact electronics.
- Low‑Voltage Embedded Systems Suitable for designs that operate on 1.14 V to 1.575 V rails where moderate gate count and memory are required.
- Compact Consumer Electronics Surface-mount 176‑TQFP package enables integration into space-constrained commercial products operating within 0 °C to 85 °C.
Unique Advantages
- Moderate Logic Density: 1,584 logic elements and ~60,000 gates provide a balance of capacity for common control, glue-logic and interface tasks without over‑provisioning.
- Generous I/O Count: 137 user I/Os allow flexible connectivity to peripherals and external devices, reducing the need for additional I/O expanders.
- Embedded Memory: Approximately 18,432 bits of on-chip RAM support local buffering and LUT-based implementations to simplify system design.
- Low‑Voltage Operation: Support for 1.14 V to 1.575 V supplies enables integration in low-voltage embedded platforms.
- Compact Surface‑Mount Package: 176‑TQFP (supplier 176‑VQFP, 20×20) allows high pin-count in a compact footprint for dense PCB layouts.
- RoHS Compliant: Meets RoHS requirements for environmental compliance in commercial products.
Why Choose AGLP060V2-VQG176?
The AGLP060V2-VQG176 positions itself as a practical, mid-density FPGA option for commercial designs that need a combination of moderate logic capacity, substantial I/O, and on-chip RAM within a compact surface-mount package. Its low-voltage operation and commercial temperature rating make it suitable for a wide range of consumer and embedded applications.
Designed and manufactured by Microchip Technology, this IGLOO PLUS device is a fit for engineers and procurement teams seeking a programmable-logic component that balances integration, I/O flexibility and package density for short- to mid-range complexity designs.
Request a quote or submit an inquiry to obtain pricing and availability for the AGLP060V2-VQG176.

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