AGLP060V5-CS201I

The AGLP060V5-CS201I is an IGLOO PLUS Field Programmable Gate Array (FPGA) supplied in a compact 201‑VFBGA (201‑CSP, 8×8) surface‑mount package. It provides 1,584 logic elements, approximately 0.018 Mbits of embedded RAM, and up to 157 I/O pins in an industrial‑grade device rated from -40 °C to 100 °C.

Designed for applications requiring small‑to‑medium density programmable logic with a low‑voltage core (1.425 V to 1.575 V), this device balances logic capacity, on‑chip memory, and I/O count for integration into compact systems.

Key Features

• Core Logic  1,584 logic elements to implement custom digital functions, glue logic, and moderate combinational/sequential designs.
• Embedded Memory  Total on‑chip RAM of 18,432 bits (approximately 0.018 Mbits) suitable for small FIFOs, buffering, and register storage.
• I/O  Up to 157 I/O pins to support multiple interfaces and external device connections within a single package.
• Gate Equivalent  Approximately 60,000 gates for capacity planning and partitioning of logic functions.
• Power  Core supply voltage range of 1.425 V to 1.575 V for designs targeting a low‑voltage FPGA core.
• Package & Mounting  201‑VFBGA (CSBGA) / supplier device package 201‑CSP (8×8) in a surface‑mount form factor for compact PCB integration.
• Temperature & Grade  Industrial grade device with an operating temperature range of -40 °C to 100 °C for use in demanding environments.
• Environmental Compliance  RoHS compliant to meet standard lead‑free manufacturing requirements.

Typical Applications

• Custom digital logic and glue logic  Implement control paths and bespoke logic functions using 1,584 logic elements and integrated memory for small state machines and control buffers.
• I/O expansion and interface bridging  Use up to 157 I/Os to consolidate multiple peripheral interfaces or translate between logic domains on compact PCBs.
• Small buffering and data staging  Leverage approximately 0.018 Mbits of on‑chip RAM for short FIFOs, packet buffering, or register arrays.

Unique Advantages

• Compact, high‑density package: The 201‑VFBGA / 201‑CSP (8×8) footprint enables integration into space‑constrained designs without sacrificing I/O count.
• Balanced logic and I/O resources: 1,584 logic elements paired with 157 I/Os provide a versatile platform for mid‑range programmable tasks and interface consolidation.
• Industrial temperature capability: Rated from -40 °C to 100 °C for deployment in environments that require extended temperature range operation.
• Low‑voltage core compatibility: Core supply range of 1.425 V to 1.575 V supports designs targeting low‑voltage system rails.
• RoHS compliant: Conforms to lead‑free manufacturing practices for modern production requirements.

Why Choose AGLP060V5-CS201I?

The AGLP060V5-CS201I positions itself as a compact, industrial‑grade FPGA option for designers who need a dependable mid‑density programmable device. With 1,584 logic elements, modest embedded memory, and a substantial I/O count in a 201‑VFBGA surface‑mount package, it is appropriate for designs that require configurable logic, interface consolidation, and operation across a wide temperature range.

This part is suited to engineers and procurement teams seeking a small‑form‑factor FPGA that delivers balanced capacity and industrial robustness, while meeting RoHS environmental requirements and supporting low‑voltage core architectures.

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