AGLP060V5-CSG289

The AGLP060V5-CSG289 is a Microchip IGLOO PLUS flash-based FPGA in a compact 289-TFBGA package. It delivers a mid-range configurable fabric with 1,584 logic elements, approximately 18,432 bits of embedded RAM and support for nonvolatile on-chip FlashROM—designed for low-power, single-chip system integration in commercial embedded applications.

Built on IGLOO PLUS architecture, this device targets low-power control, interface and glue-logic roles where compact footprint, mixed-voltage I/O and retained configuration are valuable. Key value propositions include nonvolatile flash configuration, ultra-low-power Flash*Freeze capability, and a mix of I/O and clocking resources for flexible system integration.

Key Features

• Logic Capacity — 1,584 logic elements (versatile tiles / flip-flops) delivering approximately 60,000 equivalent system gates for mid-range logic implementations.
• Embedded Memory — 18,432 total RAM bits (≈18 kbits) organized in 4,608-bit blocks; true dual-port SRAM support for efficient data buffering and FIFO implementations.
• Nonvolatile Flash — On-chip reprogrammable FlashROM (1 kbit) for retained design storage and instant-on behavior after power cycles.
• Low-Power Modes — Flash*Freeze ultra-low power retention mode (typical 10 μW for AGLP060 family) plus low-power active capability for static idle operation while remaining functional in the system.
• I/O and Voltage Support — 157 user I/Os with mixed-voltage operation (1.2 V, 1.5 V, 1.8 V, 2.5 V and 3.3 V supported per the IGLOO PLUS family); bank-selectable I/O voltages and selectable input characteristics.
• Clocking and PLL — Integrated Clock Conditioning Circuit blocks with one CCC containing a PLL for clock conditioning, phase shift and multiply/divide capabilities.
• Supply and Package — Core supply specified at 1.425 V to 1.575 V. Surface-mount 289-TFBGA package (supplier device package 289-CSP, 14 × 14) for small-footprint board designs.
• Operating Range and Compliance — Commercial grade operation from 0 °C to 85 °C and RoHS compliant.

Typical Applications

• Battery-powered Embedded Control — Use Flash*Freeze and low-power active modes to implement always-on control functions while minimizing standby energy consumption.
• Consumer and Portable Electronics — Compact 289-TFBGA footprint and mixed-voltage I/Os make the device suitable for user-interface logic, sensor aggregation and protocol bridging.
• Industrial and Instrumentation Interface — Mid-range gate count and true dual-port SRAM enable data buffering, serial/parallel bridging and control glue logic in compact systems.
• Security and In-System Programming — On-chip Flash configuration and family support for secure ISP mechanisms allow protected field updates and retained configurations.

Unique Advantages

• Nonvolatile, Instant-On Configuration: Integrated FlashROM stores the design on-chip so the FPGA retains its configuration without external memory and can resume operation quickly after power-up.
• Ultra-Low Power Retention: Flash*Freeze mode (typical 10 μW for AGLP060) keeps design state, SRAM content and I/O states with minimal energy draw—beneficial for power-sensitive systems.
• Flexible Mixed-Voltage I/O: Bank-selectable I/O voltages and support across common logic levels simplify interfacing to a variety of peripherals and legacy devices.
• Compact, Surface-Mount Package: 289-TFBGA (289-CSP, 14 × 14) enables space-constrained PCB designs while providing 157 user I/Os for connectivity.
• On-Chip Clock Conditioning: Multiple CCC blocks and an integrated PLL provide clock multiplication, phase shift and conditioning without external clocking IP.
• Commercial Grade and RoHS Compliant: Designed for 0 °C to 85 °C operation and compliant with RoHS requirements for broad commercial deployment.

Why Choose AGLP060V5-CSG289?

The AGLP060V5-CSG289 balances mid-range logic capacity with low-power operation and nonvolatile configuration, making it well suited for engineers needing a compact FPGA that retains design state without external configuration memory. Its embedded SRAM, mixed-voltage I/O flexibility, integrated clocking and small 289-TFBGA footprint reduce system BOM and simplify board-level integration.

This part is ideal for designers of commercial embedded systems that require retained configuration, compact form factor, and low standby power. Long-term value is supported by a flash-based architecture for field reprogrammability and immediate-on behavior after power cycles.

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