AGLP060V5-CSG289I

The AGLP060V5-CSG289I is an IGLOO PLUS flash-based Field Programmable Gate Array (FPGA) from Microchip Technology. Built on a 130 nm flash process, this device delivers 60,000 system gates with 1,584 logic elements and approximately 18 kbits of embedded RAM in a compact 289-TFBGA (289-CSP, 14×14) surface-mount package.

Targeted at industrial applications, the device combines nonvolatile flash configuration, low-power modes (including Flash*Freeze), and flexible I/O for mixed-voltage systems, making it suitable for designs that require reprogrammability, low standby power, and robust thermal range from −40 °C to 100 °C.

Key Features

• Core & Logic — 60,000 system gates with 1,584 logic elements (versatiles/D‑FF resources) supporting reprogrammable FPGA designs and medium-density logic implementation.
• Embedded Memory — Approximately 18 kbits (18,432 bits) of on-chip SRAM organized in true dual-port blocks and supported SRAM/FIFO configurations for data buffering and state storage.
• Nonvolatile Flash Configuration — Flash-based configuration stores design data on-chip and enables Instant On behavior; includes 1 kbit of on-chip reprogrammable FlashROM for user storage.
• Low-Power Modes — Flash*Freeze technology enables ultra-low power retention; AGLP060 devices specify ~10 μW typical in Flash*Freeze and support low-power active/static idle modes for system power management.
• I/O Flexibility — 157 user I/Os with bank-selectable voltages and support for mixed 1.2V/1.5V/1.8V/2.5V/3.3V signaling and programmable output drive and slew control.
• Clock Conditioning & Performance — Integrated clock conditioning circuitry with PLL support; device family performance includes up to 250 MHz in 1.5V systems (device-level performance per system conditions).
• Security & In-System Programming — ISP capability with on-chip 128-bit AES decryption via JTAG and FlashLock feature for protecting FPGA contents.
• Industrial Grade Packaging & Temperature — Surface-mount 289-TFBGA (289-CSP, 14×14) package with operating temperature range −40 °C to 100 °C and RoHS compliance.

Typical Applications

• Industrial Control and Automation — Implement motor control logic, state machines, and deterministic I/O interfacing while meeting industrial temperature and packaging requirements.
• Low-Power Embedded Systems — Use Flash*Freeze and low-power active modes to retain configuration and minimize standby energy for battery-assisted or energy-conscious designs.
• Secure In-System Updates — Leverage on-chip AES ISP and FlashLock protection to update firmware and configuration securely over JTAG in the field.
• Mixed-Voltage Sensor and I/O Hubs — Aggregate and condition signals from varied voltage domains with bank-selectable I/O support and programmable drive strength.

Unique Advantages

• Reprogrammable Nonvolatile Memory: Flash-based configuration retains the programmed design when powered off, enabling Instant On and field reprogramming.
• Low Standby Power: Flash*Freeze mode reduces retention power to approximately 10 μW, supporting systems that require minimal idle power consumption.
• Compact, High‑I/O Package: 289-TFBGA (14×14) package provides 157 user I/Os in a small surface-mount footprint, helping reduce PCB area and BOM complexity.
• Industrial Temperature Range: Rated for −40 °C to 100 °C operation, suitable for demanding environments where thermal robustness is required.
• Integrated Security and ISP: On-chip 128-bit AES decryption for JTAG-based ISP and FlashLock technology protect IP and enable secure field updates.

Why Choose AGLP060V5-CSG289I?

The AGLP060V5-CSG289I positions itself as a medium-density, low-power FPGA optimized for industrial designs needing nonvolatile configuration, secure in-system updates, and mixed-voltage I/O flexibility. With 60k system gates, 1,584 logic elements, approximately 18 kbits of embedded RAM, and Flash*Freeze low-power capability, it is well suited for control, monitoring, interface aggregation, and security-conscious embedded applications.

Designed and manufactured by Microchip Technology and delivered in a compact 289-TFBGA surface-mount package, this device offers a balance of performance, integration, and long-term reprogrammability for engineers seeking a robust FPGA solution for industrial and embedded designs.

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