AGLP060V5-VQ176
| Part Description |
IGLOO PLUS Field Programmable Gate Array (FPGA) IC 137 18432 1584 176-TQFP |
|---|---|
| Quantity | 1,267 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 176-VQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 176-TQFP | Number of I/O | 137 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1584 | Number of Logic Elements/Cells | 1584 | ||
| Number of Gates | 60000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 18432 |
Overview of AGLP060V5-VQ176 – IGLOO PLUS Field Programmable Gate Array (FPGA) IC 137 18432 1584 176-TQFP
The AGLP060V5-VQ176 is an IGLOO PLUS Field Programmable Gate Array (FPGA) IC designed for applications requiring moderate logic density and a high pin count in a compact surface-mount package. It provides 1,584 logic elements, approximately 18,432 bits of on-chip RAM and 137 I/O pins, making it suitable for designs that need configurable logic, embedded memory and a broad set of external interfaces.
Packaged in a 176-TQFP surface-mount package with a 1.425 V–1.575 V supply range and commercial operating temperature, this device targets production designs where predictable electrical characteristics, I/O density and a compact footprint are priorities.
Key Features
- Core Logic — 1,584 logic elements providing the programmable fabric for custom digital functions and glue logic.
- Embedded Memory — Approximately 18,432 bits of on-chip RAM for buffering, small FIFOs and state storage.
- I/O Density — 137 I/O pins to support multiple external interfaces and parallel connections.
- Gate Count — 60,000 gates to characterize device complexity and integration capability.
- Power — Device supply range of 1.425 V to 1.575 V for systems designed around a defined core-voltage rail.
- Package and Mounting — 176-TQFP package, supplier device package listed as 176-VQFP (20×20), designed for surface-mount assembly.
- Thermal and Grade — Commercial grade with operating temperature from 0 °C to 85 °C.
- Environmental Compliance — RoHS compliant for environmental and regulatory alignment.
Typical Applications
- Reconfigurable logic functions — Implement custom combinational and sequential logic using 1,584 logic elements and flexible I/O routing.
- Small memory buffering — Use approximately 18,432 bits of embedded RAM for short-term storage, FIFOs or state machines.
- I/O-rich interface bridging — Leverage 137 I/O pins to bridge multiple peripheral interfaces or to aggregate signals in a compact design.
- Compact PCB designs — The 176-TQFP surface-mount package is suited to space-constrained PCBs requiring a high pin count.
Unique Advantages
- Moderate logic density: 1,584 logic elements allow implementation of a wide range of custom logic functions without excessive design complexity.
- On-chip memory availability: Approximately 18,432 bits of RAM provide localized storage to reduce external memory needs and simplify board design.
- High I/O count: 137 I/O pins enable multiple external interfaces and flexible signal routing on a single device.
- Compact, surface-mount package: 176-TQFP / 176-VQFP (20×20) footprint balances pin count with PCB area for dense board layouts.
- Defined supply window: Operation from 1.425 V to 1.575 V supports designs with a clearly defined core voltage rail.
- Production-ready grade: Commercial temperature range (0 °C to 85 °C) and RoHS compliance align with standard manufacturing requirements.
Why Choose AGLP060V5-VQ176?
The AGLP060V5-VQ176 combines a practical balance of logic resources, embedded memory and high I/O density in a compact 176-TQFP surface-mount package. Its defined supply range and commercial-grade temperature rating make it suitable for production systems that require predictable electrical behavior and a dense pinout.
This device is well suited for designers and procurement teams seeking a reconfigurable IC that offers moderate capacity for custom logic and local memory while maintaining a small PCB footprint and compliance with RoHS requirements.
Request a quote or submit an inquiry to get pricing and availability information for the AGLP060V5-VQ176. Our team can provide the details you need to evaluate this FPGA for your next design.

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