AGLP060V2-VQG176I

IC FPGA 137 I/O 176VQFP
Part Description

IGLOO PLUS Field Programmable Gate Array (FPGA) IC 137 18432 1584 176-TQFP

Quantity 182 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package176-VQFP (20x20)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case176-TQFPNumber of I/O137Voltage1.14 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1584Number of Logic Elements/Cells1584
Number of Gates60000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits18432

Overview of AGLP060V2-VQG176I – IGLOO PLUS FPGA, 176-TQFP, Industrial Grade

The AGLP060V2-VQG176I is an IGLOO PLUS flash-based Field Programmable Gate Array (FPGA) offered in a 176-pin TQFP surface-mount package. It delivers 60,000 system gates and 1,584 logic elements, making it suitable for compact, low-power embedded designs that require nonvolatile reprogrammability and flexible I/O.

Designed for industrial environments, this device combines on-chip SRAM, FlashROM storage, mixed-voltage I/O and low-power Flash*Freeze capability to support battery-backed or always-on functions while operating across a wide supply and temperature range.

Key Features

  • Core Logic  Approximately 60,000 system gates and 1,584 logic elements (cells) for mid-density logic integration.
  • Embedded Memory  Approximately 18 kbits of on-chip RAM (18,432 bits) plus 1 kbit of user FlashROM for nonvolatile storage of configuration or small data sets.
  • I/O and Voltage Flexibility  137 user I/Os with bank-selectable mixed-voltage operation; supports 1.2V, 1.5V, 1.8V, 2.5V and 3.3V signaling and I/O supply ranges referenced in the datasheet.
  • Low-Power Modes  Flash*Freeze technology enables ultra-low power retention; the AGLP060 device typically enters a Flash*Freeze mode around 10 μW. Low Power Active (static idle) allows the FPGA to remain functional while minimizing power draw.
  • Security and In-System Programming  Reprogrammable flash architecture with support for in-system programming and on-chip AES-based decryption for secure configuration where supported by the family feature set.
  • Clocking and Timing  Integrated clock conditioning circuitry with multiple CCC blocks and an on-chip PLL to support configurable multiply/divide and phase shift capabilities.
  • Package and Temperature  176-TQFP (20×20) surface-mount package; industrial-grade operating temperature range of −40 °C to 100 °C.
  • Supply Range  Device supply support and I/O power flexibility include reported ranges down to approximately 1.14 V up to 1.575 V depending on bank and configuration.

Typical Applications

  • Industrial Control  Real-time control, protocol bridging and I/O aggregation in industrial systems that require operation across −40 °C to 100 °C and robust, reprogrammable logic.
  • Low-Power Embedded Systems  Battery-backed or always-on devices that benefit from Flash*Freeze retention and Low Power Active modes to minimize standby consumption.
  • Secure Embedded Designs  Applications that require in-system reprogramming with on-chip FlashROM and AES-based configuration protection functionality.
  • Mixed-Voltage Interface Hubs  Systems that need to interface across multiple voltage domains using bank-selectable I/O voltages and a large count of general-purpose I/Os.

Unique Advantages

  • Nonvolatile, Reprogrammable Flash Architecture: Retains programmed design when powered off and supports field updates without external configuration memory.
  • Ultra-Low Power Retention: Flash*Freeze mode reduces standby draw to the low microamp range for energy-efficient always-on functionality and system power management.
  • Flexible I/O with Mixed-Voltage Support: Bank-selectable voltages and broad signaling support simplify integration with legacy and modern peripherals across multiple supply domains.
  • Integrated Clock Conditioning: On-chip CCC blocks and PLL reduce external clocking complexity while enabling adaptable clocking topologies.
  • Industrial Temperature Range: Rated for −40 °C to 100 °C operation to meet demanding environmental requirements.

Why Choose AGLP060V2-VQG176I?

The AGLP060V2-VQG176I positions itself as a compact, industrial-grade FPGA option for designers who need mid-density logic, nonvolatile reprogrammability and low-power retention capability in a surface-mount TQFP package. Its combination of approximately 60k system gates, 1,584 logic elements, roughly 18 kbits of embedded RAM and 137 I/Os provides a balanced platform for control, interface and security-focused embedded designs.

This device is suited to teams seeking a single-chip solution that supports mixed-voltage I/O, in-system reprogramming and low standby power while operating across industrial temperature ranges. The IGLOO PLUS family features referenced in the datasheet support secure configuration and flexible clocking options to help reduce BOM and simplify system design.

Request a quote or submit an inquiry to receive pricing and availability details for the AGLP060V2-VQG176I and to discuss suitability for your project needs.

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