APA450-FG256I
| Part Description |
ProASICPLUS Field Programmable Gate Array (FPGA) IC 186 110592 256-LBGA |
|---|---|
| Quantity | 531 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 186 | Voltage | 2.3 V - 2.7 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 12288 | Number of Logic Elements/Cells | 12288 | ||
| Number of Gates | 450000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 110592 |
Overview of APA450-FG256I – ProASICPLUS FPGA IC, 186 I/Os, 256-LBGA
The APA450-FG256I is a ProASICPLUS field programmable gate array (FPGA) optimized for mid-range embedded designs. It provides a balanced combination of logic capacity, on-chip memory, and a high I/O count in a compact 256-ball L-BGA package for surface-mount assembly.
Targeted at industrial applications, the device delivers 12,288 logic elements and approximately 0.11 Mbits of embedded memory to support control, interfacing, and signal conditioning tasks while operating from a 2.3–2.7 V supply across an industrial temperature range.
Key Features
- Logic Capacity Approximately 12,288 logic elements (12288) providing around 450,000 gates for medium-complexity FPGA designs.
- Embedded Memory Total on-chip RAM of 110,592 bits, approximately 0.11 Mbits of embedded memory for buffering, state machines, and small data storage.
- I/O Density 186 user I/Os to support multiple interfaces, parallel buses, and multi-channel I/O integration in a single device.
- Power Supply Operates from a 2.3 V to 2.7 V supply, enabling compatibility with common low-voltage logic domains.
- Package & Mounting 256-LBGA surface-mount package (supplier device package: 256-FPBGA, 17×17) for high pin-count in a compact footprint.
- Operating Range Industrial-grade operation with a specified temperature range of −40 °C to 85 °C for reliable field deployment.
- Compliance RoHS compliant.
Typical Applications
- Industrial Control Logic and interface consolidation in PLCs, motor controllers, and factory automation equipment where industrial temperature operation is required.
- Embedded Systems Custom glue-logic, peripheral aggregation, and state-machine implementations using the device’s 12,288 logic elements and on-chip RAM.
- Communications Modules I/O-rich front-end modules and protocol bridging that benefit from 186 user I/Os for multiple serial and parallel interfaces.
- Instrumentation & Test Equipment Signal conditioning, timing, and data-handling functions in compact instrument designs leveraging the device’s gate and memory resources.
Unique Advantages
- Balanced Logic and Memory: 12,288 logic elements paired with 110,592 bits of embedded RAM support a wide range of mid-complexity digital functions without external memory.
- High I/O Count in a Compact Package: 186 I/Os in a 256-LBGA (256-FPBGA, 17×17) footprint reduce board area while enabling multiple interfaces and channel expansion.
- Industrial Temperature Capability: Rated from −40 °C to 85 °C to meet the environmental demands of deployed industrial systems.
- Low-Voltage Operation: 2.3–2.7 V supply range accommodates common low-voltage system domains and simplifies power-supply design.
- Regulatory Compliance: RoHS compliance supports environmentally conscious manufacturing requirements.
Why Choose APA450-FG256I?
The APA450-FG256I positions itself as a mid-range FPGA choice for engineers who need a practical balance of logic density, embedded memory, and I/O capability in an industrial-grade, surface-mount package. With 12,288 logic elements, roughly 0.11 Mbits of on-chip RAM, and 186 I/Os, it is well suited to consolidate glue logic, implement control algorithms, and handle multi-channel interfacing in compact systems.
Designed for robustness and ease of integration, this device supports low-voltage system environments and industrial temperature operation, delivering a scalable platform for production designs that require reliable long-term operation and concise board-level integration.
Request a quote or submit an inquiry to receive pricing, availability, and support information for the APA450-FG256I. Our team can help evaluate fit for your project and provide procurement details.

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