APA450-FG484I

The APA450-FG484I is a ProASICPLUS flash-based FPGA IC offering 12,288 logic elements, approximately 110,592 bits of embedded memory, and 344 general-purpose I/Os in a 484-ball BGA package. It targets designs that require moderate logic density, substantial on-chip RAM, and a high I/O count within an industrial temperature range.

With a 2.3 V to 2.7 V supply range and industrial-grade qualification for operation from –40 °C to 85 °C, this device is suited to applications where robust thermal performance and a compact surface-mount BGA footprint are important design considerations.

Key Features

• Core Logic 12,288 logic elements (LEs) and an estimated 450,000 gates provide the device's primary programmable logic capacity for combinational and sequential logic implementations.
• On-Chip Memory Approximately 0.11 Mbits of embedded memory (110,592 total RAM bits) for buffering, state storage, and small data structures.
• I/O Capacity 344 general-purpose I/Os to support dense peripheral interfacing, parallel buses, and multi-channel connectivity.
• Package & Mounting 484-ball BGA package (supplier device package: 484-FPBGA, 23 × 23 mm) designed for surface-mount assembly to save board area while providing robust signal routing.
• Power Operates from a 2.3 V to 2.7 V supply range, enabling compatibility with low-voltage system rails.
• Temperature & Grade Industrial-grade device specified for operation from –40 °C to 85 °C for deployment in temperature-challenging environments.
• Regulatory Compliance RoHS compliant to support environmentally conscious manufacturing and end products.

Typical Applications

• Industrial Automation Use the high I/O count and industrial temperature range for sensor interfacing, motion-control logic, and machine I/O aggregation.
• Communications & Networking Deploy the device where moderate logic density and plentiful I/Os are needed for protocol bridging, packet buffering, or interface adaptation tasks.
• Embedded Systems Implement custom peripheral controllers, glue logic, and data-processing pipelines leveraging on-chip memory and flexible logic resources.
• Test & Measurement Apply the FPGA for signal routing, data capture control, and custom timing logic in bench and production test equipment.

Unique Advantages

• Balanced Logic and Memory: 12,288 logic elements paired with approximately 110,592 bits of RAM let you implement control, buffering, and processing functions on a single device.
• High I/O Density: 344 I/Os reduce the need for external I/O expanders and simplify board-level connectivity for multi-channel systems.
• Compact BGA Footprint: 484-ball FPBGA (23 × 23 mm) combines a small PCB area with reliable soldered connections for higher-density designs.
• Industrial Temperature Range: Specified for –40 °C to 85 °C operation to meet the environmental demands of industrial and outdoor equipment.
• Low-Voltage Operation: 2.3 V–2.7 V supply compatibility supports integration with modern low-voltage system rails.
• RoHS Compliant: Conforms to RoHS requirements to facilitate environmentally compliant manufacturing and product shipments.

Why Choose APA450-FG484I?

The APA450-FG484I delivers a practical combination of logic capacity, embedded memory, and extensive I/O within a compact 484-BGA package engineered for industrial-temperature operation. It is well suited to engineers designing mid-density FPGA solutions that demand reliable on-chip memory, a large number of external interfaces, and surface-mount packaging.

For projects that require scalable logic resources alongside robust thermal performance and low-voltage operation, the APA450-FG484I provides a predictable, component-level solution that helps reduce board-level complexity and supports long-term deployment in industrial applications.

Request a quote or submit an inquiry to purchase APA450-FG484I and include your required quantities and delivery timeframe. Our team will respond with pricing and availability information tailored to your needs.