APA450-FGG256

The APA450-FGG256 is a ProASICPLUS field programmable gate array (FPGA) offering 450,000 gates and 12,288 logic elements in a 256-LBGA surface-mount package. It integrates on-chip memory and a high I/O count to support configurable digital logic in commercial embedded designs.

Key device parameters include 110,592 bits of embedded RAM (approximately 0.11 Mbits), 186 I/Os, a 2.3 V to 2.7 V supply range, and commercial operating temperature of 0 °C to 70 °C, making it suitable for a range of general-purpose programmable-logic applications.

Key Features

• Core Logic 12,288 logic elements (LEs) and approximately 450,000 gates provide a substantial programmable fabric for implementing custom digital functions and finite-state machines.
• Embedded Memory 110,592 bits of on-chip RAM (approximately 0.11 Mbits) for buffering, small data stores, and distributed memory requirements within user logic.
• I/O Capacity 186 accessible I/O pins support extensive interfacing to peripherals, sensors, and external buses for system integration and glue logic.
• Power Domain Operates from a 2.3 V to 2.7 V supply range to match common commercial logic levels and power architectures.
• Package & Mounting Supplied in a 256-LBGA (256-FPBGA, 17×17) surface-mount package that enables compact board-level integration.
• Commercial Grade & Environmental Rated for 0 °C to 70 °C operating temperature and RoHS compliant for regulatory and assembly considerations.

Typical Applications

• Commercial Embedded Systems — Implement control logic, protocol handling, and custom data paths in space-constrained commercial products.
• Interface Bridging and Glue Logic — Use the abundant I/Os and programmable fabric to translate between buses, manage peripherals, or consolidate discrete logic.
• Sensor and Peripheral Processing — Offload deterministic preprocessing, filtering, or event aggregation using on-chip logic and embedded RAM.
• Prototyping and System Integration — Evaluate and validate digital functions and system-level logic prior to downstream design decisions.

Unique Advantages

• High Logic Density: 12,288 logic elements and 450,000 gates allow implementation of relatively complex custom logic without external ASICs or multiple CPLDs.
• Balanced On-Chip Memory: Approximately 0.11 Mbits of embedded RAM provides local storage for buffering and small data structures directly inside the FPGA fabric.
• Extensive I/O Count: 186 I/Os enable broad peripheral and bus connectivity, reducing the need for external I/O expanders.
• Compact BGA Package: The 256-LBGA (256-FPBGA, 17×17) format supports compact PCB layouts while maintaining thermal and signal routing advantages of a BGA.
• Commercial Voltage and Temperature: Operates from 2.3 V to 2.7 V and is specified for 0 °C to 70 °C, matching common commercial design environments.
• RoHS Compliant: Meets RoHS requirements for lead-free assembly and regulatory compliance in commercial products.

Why Choose APA450-FGG256?

The APA450-FGG256 delivers a balanced combination of logic capacity, embedded memory, and I/O resources in a compact 256-LBGA package for commercial embedded designs. Its specification set — including 12,288 logic elements, approximately 0.11 Mbits of RAM, 186 I/Os, and a 2.3 V to 2.7 V supply range — makes it suitable for applications that require flexible programmable logic and robust interfacing within commercial temperature ranges.

This device is a fit for design teams seeking a programmable, board-level solution to consolidate discrete logic, implement custom interfaces, or prototype system functions while maintaining compliance with RoHS requirements.

Request a quote or submit an inquiry to receive pricing and availability information for APA450-FGG256.