APA450-FGG144I

IC FPGA 100 I/O 144FBGA
Part Description

ProASICPLUS Field Programmable Gate Array (FPGA) IC 100 110592 144-LBGA

Quantity 563 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package144-FPBGA (13x13)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case144-LBGANumber of I/O100Voltage2.3 V - 2.7 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs12288Number of Logic Elements/Cells12288
Number of Gates450000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits110592

Overview of APA450-FGG144I – ProASICPLUS FPGA, 100 I/Os, 144-LBGA

The APA450-FGG144I is a ProASICPLUS Field Programmable Gate Array (FPGA) IC offering mid-range logic density and on-chip memory in a compact 144-LBGA package. As an FPGA device, it provides configurable logic resources and I/O for custom digital functions in industrial and embedded systems.

With 12,288 logic elements, approximately 0.11 Mbits of embedded RAM, and 100 I/O pins, this device targets applications that require flexible logic implementation, moderate on-chip memory, and a small-footprint surface-mount package. The device supports a 2.3 V to 2.7 V supply range and an operating temperature range of −40 °C to 85 °C, suitable for industrial environments.

Key Features

  • Logic Capacity  12,288 logic elements (configurable logic blocks) and an estimated 450,000 gates for implementing custom digital functions and state machines.
  • Embedded Memory  Total on-chip RAM of 110,592 bits, approximately 0.11 Mbits of embedded memory for buffering, FIFOs, and small data storage.
  • I/O Count  100 user I/Os to interface with peripherals, sensors, and external logic devices.
  • Power  Core supply range of 2.3 V to 2.7 V to match mid-voltage system rails.
  • Package and Mounting  144-LBGA package (supplier device package: 144-FPBGA, 13×13) in a surface-mount form factor for compact PCB integration.
  • Operating Range  Industrial-grade operating temperature from −40 °C to 85 °C for deployment in a wide range of environments.
  • Regulatory Compliance  RoHS compliant for reduced environmental impact in manufacturing and assembly.

Typical Applications

  • Industrial Control  Implement custom control logic, sequencing, and I/O aggregation using the device’s 12,288 logic elements and 100 I/Os for factory automation and machine control.
  • Communications Equipment  Use the on-chip memory and configurable logic to implement protocol handling, packet buffering, and interface bridging in networking modules.
  • Embedded System Glue Logic  Replace discrete logic with programmable logic for address decoding, bus interfacing, and customized peripheral control in embedded designs.
  • Test and Measurement  Leverage flexible I/O and deterministic hardware logic for signal conditioning, timing control, and data collection tasks.

Unique Advantages

  • Mid-range logic density: 12,288 logic elements and ~450k gates provide a balance of capacity and cost for many embedded designs.
  • On-chip buffering: Approximately 0.11 Mbits of embedded RAM supports local data storage and low-latency buffering without external memory.
  • Compact surface-mount package: The 144-LBGA (13×13 FPBGA) package minimizes PCB area while retaining substantial I/O count.
  • Industrial temperature rating: −40 °C to 85 °C operation enables deployment in demanding environmental conditions.
  • RoHS compliant: Designed to meet environmental and manufacturing requirements for modern electronics production.
  • Flexible I/O count: 100 I/Os allow interfacing to a broad set of peripherals and external devices without added components.

Why Choose APA450-FGG144I?

The APA450-FGG144I positions itself as a practical FPGA choice for engineers who need mid-level programmable logic capacity, embedded memory, and a compact package for industrial and embedded applications. Its combination of 12,288 logic elements, approximately 0.11 Mbits of RAM, and 100 I/Os provides the building blocks for custom logic, interface bridging, and control tasks.

Engineers designing industrial controls, communications modules, or space-constrained embedded systems will find the APA450-FGG144I delivers configurable functionality, a small-footprint 144-LBGA package, and an industrial temperature range, helping reduce board-level complexity and support longer-term deployment needs.

Request a quote or submit an inquiry to receive pricing and availability information for the APA450-FGG144I. Our team can provide lead-time details and help evaluate the device for your project requirements.

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