APA450-FG484A
| Part Description |
ProASICPLUS Field Programmable Gate Array (FPGA) IC 344 110592 484-BGA |
|---|---|
| Quantity | 493 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Automotive | Operating Temperature | -40°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 344 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 12288 | Number of Logic Elements/Cells | 12288 | ||
| Number of Gates | 450000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | AEC-Q100 | Total RAM Bits | 110592 |
Overview of APA450-FG484A – ProASICPLUS Field Programmable Gate Array (FPGA) IC 344 110592 484-BGA
The APA450-FG484A is a ProASICPLUS field programmable gate array (FPGA) supplied in a 484-ball FPBGA package (23 × 23). It provides 12,288 logic elements, approximately 0.11 Mbits of embedded RAM, 344 user I/O pins and a gate count of 450,000 for mid-range programmable logic designs.
Built for applications that require high I/O density and on-chip memory within a surface-mount BGA footprint, the device is rated for automotive use with AEC-Q100 qualification and an extended operating temperature range of −40 °C to 125 °C.
Key Features
- Core / Logic 12,288 logic elements (LEs) and an effective gate capacity of 450,000 gates to implement combinational and sequential logic functions.
- Embedded Memory Total on-chip RAM of 110,592 bits (approximately 0.11 Mbits) for buffering, FIFO, and small data tables without external memory.
- I/O Density 344 user I/O pins to support wide parallel interfaces and multiple peripherals directly from the FPGA fabric.
- Power Designed to operate from a supply voltage range of 2.375 V to 2.625 V for compatible system power rails.
- Package & Mounting 484-ball FPBGA (23 × 23) surface-mount package for compact board integration and high pin density.
- Temperature & Qualification Automotive grade with AEC-Q100 qualification and an operating temperature range of −40 °C to 125 °C for deployment in demanding thermal environments.
- Environmental Compliance RoHS compliant.
Typical Applications
- Automotive Electronics Programmable logic for control modules and sensor interfaces where AEC-Q100 qualification and extended temperature operation are required.
- I/O-Intensive Embedded Systems High-pin-count designs that need 344 I/O lines for parallel buses, numerous sensors, or mixed peripheral connectivity.
- On-Board System Integration Mid-range logic integration and on-chip RAM for consolidating glue logic and small data storage in compact, surface-mount assemblies.
Unique Advantages
- Highly integrated mid-range logic: 12,288 logic elements and 450,000 gates enable substantial functionality within a single FPGA, reducing external components.
- Ample on-chip RAM: Approximately 0.11 Mbits of embedded memory supports buffering and small data structures without additional memory devices.
- High I/O pin count: 344 user I/Os simplify direct interfacing to multiple peripherals and parallel buses.
- Automotive-ready qualification: AEC-Q100 qualification and −40 °C to 125 °C operating range deliver the robustness required for automotive environments.
- Compact BGA footprint: 484-FPBGA (23 × 23) surface-mount package provides high pin density in a compact form factor for space-constrained boards.
- Controlled supply window: Narrow 2.375 V to 2.625 V supply range supports predictable power integration with compatible system rails.
Why Choose APA450-FG484A?
The APA450-FG484A positions itself as a mid-range, automotive-qualified FPGA that balances a meaningful logic element count, substantial I/O capacity, and on-chip RAM in a compact 484-BGA package. Its AEC-Q100 qualification and extended temperature rating make it suited to designs that require both programmability and durability across harsh thermal conditions.
This device is a fit for engineers designing I/O-dense embedded systems or automotive modules that need to consolidate logic, reduce external component count, and operate reliably from −40 °C to 125 °C while running from a 2.375 V–2.625 V supply.
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