APA450-FG484A

IC FPGA 344 I/O 484FBGA
Part Description

ProASICPLUS Field Programmable Gate Array (FPGA) IC 344 110592 484-BGA

Quantity 493 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeAutomotiveOperating Temperature-40°C – 125°C
Package / Case484-BGANumber of I/O344Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs12288Number of Logic Elements/Cells12288
Number of Gates450000ECCN3A991DHTS Code8542.39.0001
QualificationAEC-Q100Total RAM Bits110592

Overview of APA450-FG484A – ProASICPLUS Field Programmable Gate Array (FPGA) IC 344 110592 484-BGA

The APA450-FG484A is a ProASICPLUS field programmable gate array (FPGA) supplied in a 484-ball FPBGA package (23 × 23). It provides 12,288 logic elements, approximately 0.11 Mbits of embedded RAM, 344 user I/O pins and a gate count of 450,000 for mid-range programmable logic designs.

Built for applications that require high I/O density and on-chip memory within a surface-mount BGA footprint, the device is rated for automotive use with AEC-Q100 qualification and an extended operating temperature range of −40 °C to 125 °C.

Key Features

  • Core / Logic  12,288 logic elements (LEs) and an effective gate capacity of 450,000 gates to implement combinational and sequential logic functions.
  • Embedded Memory  Total on-chip RAM of 110,592 bits (approximately 0.11 Mbits) for buffering, FIFO, and small data tables without external memory.
  • I/O Density  344 user I/O pins to support wide parallel interfaces and multiple peripherals directly from the FPGA fabric.
  • Power  Designed to operate from a supply voltage range of 2.375 V to 2.625 V for compatible system power rails.
  • Package & Mounting  484-ball FPBGA (23 × 23) surface-mount package for compact board integration and high pin density.
  • Temperature & Qualification  Automotive grade with AEC-Q100 qualification and an operating temperature range of −40 °C to 125 °C for deployment in demanding thermal environments.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • Automotive Electronics  Programmable logic for control modules and sensor interfaces where AEC-Q100 qualification and extended temperature operation are required.
  • I/O-Intensive Embedded Systems  High-pin-count designs that need 344 I/O lines for parallel buses, numerous sensors, or mixed peripheral connectivity.
  • On-Board System Integration  Mid-range logic integration and on-chip RAM for consolidating glue logic and small data storage in compact, surface-mount assemblies.

Unique Advantages

  • Highly integrated mid-range logic: 12,288 logic elements and 450,000 gates enable substantial functionality within a single FPGA, reducing external components.
  • Ample on-chip RAM: Approximately 0.11 Mbits of embedded memory supports buffering and small data structures without additional memory devices.
  • High I/O pin count: 344 user I/Os simplify direct interfacing to multiple peripherals and parallel buses.
  • Automotive-ready qualification: AEC-Q100 qualification and −40 °C to 125 °C operating range deliver the robustness required for automotive environments.
  • Compact BGA footprint: 484-FPBGA (23 × 23) surface-mount package provides high pin density in a compact form factor for space-constrained boards.
  • Controlled supply window: Narrow 2.375 V to 2.625 V supply range supports predictable power integration with compatible system rails.

Why Choose APA450-FG484A?

The APA450-FG484A positions itself as a mid-range, automotive-qualified FPGA that balances a meaningful logic element count, substantial I/O capacity, and on-chip RAM in a compact 484-BGA package. Its AEC-Q100 qualification and extended temperature rating make it suited to designs that require both programmability and durability across harsh thermal conditions.

This device is a fit for engineers designing I/O-dense embedded systems or automotive modules that need to consolidate logic, reduce external component count, and operate reliably from −40 °C to 125 °C while running from a 2.375 V–2.625 V supply.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for the APA450-FG484A.

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